Driving mechanism

ABSTRACT

A driving mechanism includes a frame, a carrying base, and a drive module. The carrying base is disposed in the frame, and includes a carrying body, a first stop element and a second stop element. The carrying body is configured to carry an optical element. The first stop element is disposed on the carrying body, and configured to limit the range of motion of the carrying body in a first direction. The second stop element is disposed on the carrying body, and configured to limit the range of motion of the carrying body in the first direction. The driving module is disposed in the frame, and configured to move the carrying body relative to the frame. The first direction is parallel to the axis of the optical element, and the first stop element is closer to the top portion of the frame than the second stop element.

CROSS REFERENCE TO RELATED APPLICATIONS

The present application claims priority to U.S. Provisional PatentApplication No. 62/507,478, filed on May 17, 2017, and China PatentApplication No. 201810444905.6 filed on May 10, 2018, which isincorporated by reference herein in its entirety.

BACKGROUND OF THE DISCLOSURE Field of the Disclosure

The disclosure relates to a driving mechanism, and more particularly toa driving mechanism for moving an optical element.

Description of the Related Art

As technology has advanced, a lot of electronic devices (for example,cameras and smartphones) have incorporated the functionality of takingphotographs and recording video. These electronic devices have becomemore commonplace, and have been developed to be more convenient andthin. In some electronic devices, an electromagnetic driving mechanismsuch as a Voice Coil Motor (VCM) is disposed therein to adjust the focusof a lens. However, owing to the miniaturization of the electronicdevices, how to achieve efficient space utilization of the innercomponents within the driving mechanism has become an important issue.

BRIEF SUMMARY OF THE DISCLOSURE

In view of the aforementioned problems, an object of the disclosure isto provide a driving mechanism for moving an optical element. Thedriving mechanism includes a housing, a hollow frame, a holder, and adriving assembly. The frame is fixed to the housing and has a stopsurface. The holder is movably disposed in the housing for holding theoptical element. The driving assembly is disposed in the housing todrive the holder and the optical element moving along the optical axisof the optical element relative to the frame. Specifically, the stopsurface is parallel to the optical axis to contact the holder andrestrict the holder in a limit position.

A driving mechanism is provided for moving an optical element in anotherembodiment of the present disclosure. The driving mechanism includes afixed module, a holder for holding the optical element, a drivingassembly, and a resilient member. The driving assembly can drive theholder and the optical element to move relative to the fixed module. Theresilient member has a connection portion, an end portion, and a narrowportion connecting the connection portion with the end portion. Theconnecting portion is connected to the holder, and the end portion iselectrically connected to the driving assembly by soldering or welding.

A driving mechanism is provided in another embodiment of the presentdisclosure. The driving mechanism includes a case, a holder, and adriving module. The holder is disposed in the case for holding anoptical member. The driving module is disposed in the case for drivingthe holder. The case is substantially quadrilateral and includes a firstside and a second side, and the driving module includes a first magneticdriving component winding on a periphery of the holder, wherein thefirst magnetic driving component includes a first segment and a secondsegment, the first segment is substantially parallel to the first side,and the second segment is substantially parallel to the second side,wherein the distance between the first segment and the first side isdifferent from the distance between the second segment and the secondside.

A driving mechanism is provided in another embodiment of the presentdisclosure. The driving mechanism includes a base, a carrier, a drivingassembly, and a damping member. The base includes a plurality ofpositioning members. The carrier is disposed on the base, and carries anoptical member, wherein the positioning members are farther away from anoptical axis of the optical member than the carrier. The damping memberis disposed between the positioning members and the carrier, and is indirect contact with the positioning members and the carrier.

A driving mechanism is provided in another embodiment of the presentdisclosure. The driving mechanism includes a frame, a carrying base, anda drive module. The frame includes a position element connected to theupper surface of the frame. The carrying base is disposed in the frameand configured to carry an optical element, wherein the upper surface isperpendicular to an optical axis that passes through the opticalelement. The drive module is disposed between the frame and the carryingbase, and configured to drive the carrying base to move relative to theframe.

A driving mechanism is provided in another embodiment of the presentdisclosure. The driving mechanism includes a frame, a carrying base, anda drive module. The carrying base is disposed in the frame, and includesa carrying body, a first stop portion, and a second stop portion. Thecarrying body is configured to carry an optical element. The first stopportion is disposed on the carrying body, and configured to limit therange of motion of the carrying body in a first direction. The secondstop portion is disposed on the carrying body, and configured to limitthe range of motion of the carrying body in the first direction.

A driving mechanism is provided in another embodiment of the presentdisclosure. The driving mechanism includes a carrier, an optical lens, afirst electromagnetic driving assembly, a fixed portion, and a firstelastic member. The carrier has a side wall, and the optical lens isdisposed in the carrier. The first electromagnetic driving assembly isdisposed on the carrier. The side wall is disposed between the opticallens and the first electromagnetic driving assembly, and the opticallens and the first electromagnetic driving assembly is in contact withthe side wall. The first elastic member is connected to the carrier andthe fixed portion. At least a portion of the first elastic memberoverlaps the side wall as observed from the optical axis of the opticallens.

A driving mechanism for supporting an optical member is provided inanother embodiment of the present disclosure. The driving mechanismincludes a base, a frame, a movable portion, a driving module, and anadhesive member. The base includes a plurality of first sidewalls, andat least one recess is formed on the first sidewalls. The frame includesa plurality of second sidewalls, and at least one opening is formed onthe second sidewalls. The base and the frame can form a hollow box, andthe opening corresponds to the recess. The movable portion and thedriving module are disposed in the hollow box. The driving module candrive the movable portion to move relative to the base. The adhesivemember is accommodated in the opening and the recess, and extended alongthe first sidewalls. The adhesive member is disposed between the firstsidewalls and the second sidewalls, and the first and second sidewallsare parallel to the optical axis of the optical member.

A driving mechanism for moving an optical element is provided in anotherembodiment of the present disclosure. The driving mechanism includes adriving module for moving an optical element. The driving moduleincludes a housing, a frame, a holder, and a driving assembly. The frameis fixed to the housing and forms a depressed surface adjacent to thehousing. Specifically, the depressed surface faces the housing and isnot in contact with the housing. The holder is movably disposed in thehousing for holding the optical element. The drive assembly is disposedin the housing to drive the holder and the optical element to moverelative to the frame.

BRIEF DESCRIPTION OF THE DRAWINGS

The disclosure can be more fully understood by reading the subsequentdetailed description and examples with references made to theaccompanying drawings, wherein:

FIG. 1-1 is an exploded view of a lens module 1-10 in accordance with anembodiment of the disclosure.

FIG. 1-2 is a schematic view of the lens module 1-10 in FIG. 1-1 afterassembly with the optical element 1-E removed.

FIG. 1-3 is a cross-sectional view taken along line 1A1-1A1 in FIG. 1-2.

FIG. 1-4 is a schematic view of the driving mechanism of FIG. 1-2 withthe housing 1-H removed.

FIGS. 1-5 and 1-6 are schematic views of the frame 1-F in FIG. 1-4.

FIG. 1-7 is a schematic view of the driving mechanism in FIG. 1-2 withthe housing 1-H and the circuit board 1-P removed.

FIG. 1-8 is a cross-sectional view taken along line 1A2-1A2 in FIG. 1-2.

FIG. 1-9 is a cross-sectional view taken along line 1A3-1A3 in FIG. 1-2.

FIG. 2-1 is an exploded view of a driving mechanism in accordance withan embodiment of the disclosure.

FIG. 2-2 is a schematic view of the driving assembly in FIG. 2-1 afterassembly.

FIG. 2-3 is a cross-sectional view taken along the line 2A1-2A1 in FIG.2-2.

FIG. 2-4 is a schematic view of one of the lower springs 2-S2 in FIG.2-1.

FIG. 2-5 is a schematic view showing relative position of the two lowersprings 2-S2 and the base 2-B in FIG. 2-1 after assembly.

FIG. 2-6 is a top view of the lower springs 2-S2, the base 2-B, theholder 2-R, and the coil 2-C in FIG. 2-1 after assembly.

FIG. 2-7 is a partial enlarged view of the lower spring 2-S2, the base2-B, the holder 2-R, and the coil 2-C after assembly.

FIG. 2-8 is a cross-sectional view taken along the line 2A2-2A2 in FIG.2-6.

FIG. 2-9 is a schematic view of a lower spring 2-S2 in accordance withanother embodiment of the disclosure.

FIG. 2-10 is an exploded view showing a holder 2-R, a coil 2-C, a wire2-W, two lower springs 2-S2, a base 2-B, and two conductive pins 2-P inaccordance with another embodiment of the disclosure

FIG. 2-11 is a schematic view of the holder 2-R, the coil 2-C, the wire2-W, the lower springs 2-S2, the base 2-B, and the conductive pins 2-Pin FIG. 2-10 after assembly.

FIG. 2-12 is a partial enlarged view of the holder 2-R, the coil 2-C,the wire 2-W, the lower spring 2-S2, and the base 2-B in FIG. 2-11.

FIG. 2-13 is a partial enlarged view showing a corner of the base 2-B.

FIG. 2-14 is an enlarged cross-sectional view showing a column 2-B1 ofthe base 2-B extended through the lower spring 2-S2.

FIG. 2-15 is a partial enlarged view showing the holder 2-R, the coil2-C, and the lower spring 2-S2 in FIG. 2-10 after assembly.

FIG. 2-16 is a partial enlarged view showing a holder 2-R, a coil 2-C,and a lower spring 2-S2 in accordance with another embodiment of thedisclosure.

FIG. 2-17 is a schematic view of a frame 2-F in accordance with anotherembodiment of the disclosure.

FIG. 2-18 is a partial cross-sectional view showing a depressed portion2-F2 of the frame 2-F in FIG. 2-17 which is spaced apart from an innersurface of a housing 2-H after assembly.

FIG. 2-19 is a partial cross-sectional view showing a recess 2-F3 of theframe 2-F in FIG. 2-17 which is spaced apart from an inner surface of ahousing 2-H after assembly.

FIG. 2-20 is a schematic view of a holder 2-R, a coil 2-C, and at leastone wire after assembly, in accordance with another embodiment of thedisclosure.

FIGS. 2-21 and 2-22 are schematic views showing relative position of aholder 2-R and a frame 2-F of a driving mechanism after assembly, inaccordance with another embodiment of the disclosure.

FIG. 3-1 is a perspective view of a driving mechanism according to anembodiment of the present disclosure.

FIG. 3-2 is an exploded view of the driving mechanism in FIG. 3-1.

FIG. 3-3 is a cross-segmental view along line 3A-3A′ in FIG. 3-1.

FIG. 3-4A is a perspective view of a driving mechanism according to anembodiment of the present disclosure.

FIG. 3-4B is an exploded view of the driving mechanism in FIG. 3-4A.

FIG. 3-4C is a cross-segmental view along line 3B-3B′ in FIG. 3-4A.

FIGS. 3-5A and 3-5B are top views of some components of a drivingmechanism according to an embodiment of the present disclosure.

FIG. 3-5C is a top perspective view of some components of a drivingmechanism according to an embodiment of the present disclosure.

FIGS. 3-6A and 3-6B are top views of some components of a drivingmechanism according to an embodiment of the present disclosure.

FIG. 3-6C is a top perspective view of some components of a drivingmechanism according to an embodiment of the present disclosure.

FIGS. 3-7A and 3-7B are top views of some components of a drivingmechanism according to an embodiment of the present disclosure.

FIG. 3-8A is a bottom perspective view of some components of a drivingmechanism according to an embodiment of the present disclosure.

FIGS. 3-8B and 3-8C are bottom perspective views of some components of adriving mechanism according to an embodiment of the present disclosure.

FIGS. 3-9A to 3-9D are flow diagrams of an assembly method of a drivingmechanism according to an embodiment of the present disclosure.

FIG. 4-1 is a schematic perspective view illustrating a drivingmechanism in accordance with an embodiment of the present disclosure.

FIG. 4-2 is an exploded view illustrating the driving mechanism in FIG.4-1.

FIG. 4-3A is a cross-sectional view illustrating the driving mechanismalong line 4A-4A′ in FIG. 4-1.

FIG. 4-3B is a cross-sectional view illustrating the driving mechanismalong line 4B-4B′ in FIG. 4-1.

FIG. 4-4A is a schematic view illustrating the relative positionsbetween a carrier and a base after assembly in accordance with anembodiment of the present disclosure.

FIG. 4-4B is an enlarged view illustrating a region 4-M in FIG. 4-4A.

FIG. 4-4C is an enlarged view illustrating the carrier and the baseafter assembly in accordance with another embodiment of the presentdisclosure.

FIG. 4-5A is a schematic perspective view illustrating the drivingmechanism in accordance with another embodiment of the presentdisclosure.

FIG. 4-5B is a schematic perspective view illustrating interiorcomponents of the driving mechanism in FIG. 4-5A.

FIG. 4-5C is a partial cross-sectional view illustrating the drivingmechanism in FIG. 4-5A.

FIG. 4-6A is a schematic perspective view illustrating the drivingmechanism in accordance with another embodiment of the presentdisclosure.

FIG. 4-6B is a partial schematic perspective view illustrating the basein accordance with an embodiment of the present disclosure.

FIG. 4-6C is a partial schematic perspective view illustrating the basein accordance with another embodiment of the present disclosure.

FIG. 4-6D is a partial schematic perspective view illustrating the basein accordance with an embodiment of the present disclosure.

FIG. 4-7A is a partial schematic perspective view illustrating the basein accordance with another embodiment of the present disclosure.

FIG. 4-7B is a partial cross-sectional view illustrating the base inFIG. 4-7A and the housing after assembly.

FIG. 4-7C is a partial cross-sectional view illustrating the base inFIG. 4-7A and the housing after assembly in accordance with anotherembodiment of the present disclosure.

FIG. 4-8A is a top view illustrating a first elastic member inaccordance with an embodiment of the present disclosure.

FIG. 4-8B is a top view illustrating the first elastic member afterfilling adhesive in accordance with an embodiment of the presentdisclosure.

FIG. 4-9A is a schematic perspective view illustrating the carrier and adriving coil in accordance with an embodiment of the present disclosure.

FIG. 4-9B is an enlarged view illustrating a region 4-N in FIG. 4-9A.

FIG. 4-10A is a schematic view illustrating the relative positionsbetween the first elastic member, the second elastic member, themagnetic members, and the base after assembly in accordance with anembodiment of the present disclosure.

FIG. 4-10B is a side view illustrating the relative positions betweenthe first elastic member, the second elastic member, and the magneticmembers in FIG. 4-10A after assembly.

FIG. 4-10C is a schematic view illustrating the relative positionsbetween the first elastic member, the second elastic member, and thebase in FIG. 4-10A after assembly.

FIG. 4-10D is a schematic perspective view illustrating the positioningmember in accordance with another embodiment of the present disclosure.

FIG. 5-1 is a perspective view of an electronic device in accordancewith some embodiments of the disclosure.

FIG. 5-2 is a perspective view of a driving mechanism in accordance withsome embodiments of the present disclosure.

FIG. 5-3 is an exploded view of the driving mechanism in accordance withsome embodiments of the present disclosure.

FIG. 5-4 is a perspective view of the frame and the carrying base inaccordance with some embodiments of the present disclosure.

FIGS. 5-5A to 5-5C are schematic views of the frame and the carryingbase in accordance with some embodiments of the present disclosure.

FIG. 5-6 is a perspective view of a frame in accordance with someembodiments of the disclosure.

FIG. 5-7 is a top view of the frame in accordance with some embodimentsof the disclosure.

FIG. 5-8 is a perspective view of a frame and a combination frame 7 inaccordance with some embodiments of the disclosure.

FIG. 5-9 is a top view of the frame and the combination frame inaccordance with some embodiments of the disclosure.

FIG. 5-10 is an exploded view of a driving mechanism in accordance withsome embodiments of the present disclosure.

FIG. 5-11 is a perspective view of a carrying base and an elasticelement in accordance with embodiments of the present disclosure.

FIG. 5-12 is a side view of the carrying base and the elastic element inaccordance with embodiments of the present disclosure.

FIG. 5-13 is a top view of a frame, a carrying base and a drive modulein accordance with some embodiments of the present disclosure.

FIG. 5-14 is a side view of the carrying base and the elastic element inaccordance with some embodiments of the present disclosure.

FIG. 5-15 is an exploded view of the frame and the carrying base inaccordance with some embodiments of the present disclosure.

FIG. 5-16 is a cross-sectional view of the frame and the carrying basein accordance with some embodiments of the present disclosure.

FIG. 5-17 is an exploded view of a frame and a carrying base inaccordance with some embodiments of the present disclosure.

FIG. 5-18 is a cross-sectional view of the frame and the carrying basein accordance with some embodiments of the present disclosure.

FIG. 5-19 is a schematic view of the frame and the carrying base inaccordance with some embodiments of the present disclosure.

FIG. 6-1 is a perspective view of an electronic device in accordancewith some embodiments of the disclosure.

FIG. 6-2 is a perspective view of a driving mechanism in accordance withsome embodiments of the present disclosure.

FIG. 6-3 is an exploded view of the driving mechanism in accordance withsome embodiments of the present disclosure.

FIG. 6-4 is a perspective view of the frame and the carrying base inaccordance with some embodiments of the present disclosure.

FIGS. 6-5A to 6-5C are schematic views of the frame and the carryingbase in accordance with some embodiments of the present disclosure.

FIG. 6-6A is a perspective view of a frame and a drive wire inaccordance with some embodiments of the present disclosure.

FIG. 6-6B is a perspective view of a frame in accordance with someembodiments of the present disclosure.

FIG. 6-7 is a top view of the frame, the carrying base and the drivemodule in accordance with some embodiments of the present disclosure.

FIG. 6-8 is a perspective view of the carrying base and the bottomelastic element in accordance with some embodiments of the presentdisclosure.

FIG. 6-9 is a bottom view of the carrying base and the bottom elasticelement in accordance with some embodiments of the present disclosure.

FIG. 6-10 is a perspective view of the carrying base, the bottom elasticelement, and the base in accordance with some embodiments of the presentdisclosure.

FIG. 6-11 is a cross-sectional view of the frame, the carrying base, andthe base in accordance with some embodiments of the present disclosure.

FIG. 6-12 is a cross-sectional view of the carrying base and the bottomelastic element in accordance with some embodiments of the presentdisclosure.

FIG. 6-13 is a perspective view of the carrying base in accordance withsome embodiments of the present disclosure.

FIG. 7-1 is a schematic diagram of an electronic device according to anembodiment of the disclosure;

FIG. 7-2 is a schematic diagram of a driving mechanism according to anembodiment of the disclosure;

FIG. 7-3 is an exploded-view diagram of a driving mechanism according toan embodiment of the disclosure;

FIG. 7-4 is a schematic diagram of a first elastic member according toan embodiment of the disclosure;

FIG. 7-5 is a schematic diagram of a second elastic member according toan embodiment of the disclosure;

FIG. 7-6A is a schematic diagram of a movable portion according to anembodiment of the disclosure;

FIG. 7-6B is another schematic diagram of the movable portion accordingto an embodiment of the disclosure;

FIG. 7-6C is a cross-sectional view of the movable portion according toan embodiment of the disclosure;

FIG. 7-6D is an enlarged schematic diagram of a 7-S region in FIG. 7-6B;

FIG. 7-7A is a cross-sectional view along line 7A-7A in FIG. 7-2;

FIG. 7-7B is a cross-sectional view along line 7B-7B in FIG. 7-2;

FIG. 7-7C is a schematic diagram of the first elastic member and thesecond elastic member as observed from the optical axis of the opticallens when the driving mechanism is assembled according to an embodimentof the disclosure; and

FIG. 7-7D is a schematic diagram of a lead at the end of the firstelectromagnetic driving assembly connected to the second elastic memberwith solder according to an embodiment of the disclosure.

FIG. 8-1 is a schematic diagram of an electronic device according to anembodiment of the disclosure;

FIG. 8-2 is a schematic diagram of a driving mechanism according to anembodiment of the disclosure;

FIG. 8-3 is an exploded-view diagram of a driving mechanism according toan embodiment of the disclosure;

FIG. 8-4A is a schematic diagram of a base according to an embodiment ofthe disclosure;

FIG. 8-4B is a partial cross-sectional view of a base according to anembodiment of the disclosure;

FIG. 8-4C is a top plan view of a base according to an embodiment of thedisclosure;

FIG. 8-5 is a schematic diagram of a frame according to an embodiment ofthe disclosure;

FIG. 8-6 is a schematic diagram of the base joined to the frame throughan adhesive member according to an embodiment of the disclosure;

FIG. 8-7 is a schematic diagram of a metal wire connected to a circuitboard with solder according to an embodiment of the disclosure;

FIG. 8-8A is a schematic diagram of a base according to anotherembodiment of the disclosure;

FIG. 8-8B is a schematic diagram of a second electromagnetic drivingassembly attached to the base with glue according to another embodimentof the disclosure;

FIG. 8-9 is a schematic diagram of a base, a movable portion, a firstelectromagnetic driving assembly, and a plurality of secondelectromagnetic driving assemblies according to another embodiment ofthe disclosure;

FIGS. 8-10A and 8-10B are schematic diagrams of a base according toanother embodiment of the disclosure;

FIG. 8-11 is a schematic diagram of a base according to anotherembodiment of the disclosure;

FIG. 8-12 is a schematic diagram of a base and a plurality of secondelectromagnetic driving assemblies according to another embodiment ofthe disclosure;

FIG. 8-13A is a schematic diagram of a driving mechanism according toanother embodiment of the disclosure, wherein the adhesive member hasnot been filled; and

FIG. 8-13B is a schematic diagram of a metal wire and an elastic memberaccording to another embodiment of the disclosure;

FIG. 9-1 is an exploded view of a lens module in accordance with anembodiment of the disclosure.

FIG. 9-2 is a schematic view of the lens module in FIG. 9-1 afterassembly, wherein the optical element 9-E is removed therefrom.

FIG. 9-3 is a cross-sectional view taken along the line 9A1-9A1 in FIG.9-2.

FIG. 9-4 is a cross-sectional view taken along the line 9A2-9A2 in FIG.9-2.

FIG. 9-5 is a schematic view of the driving mechanism of FIG. 9-2 withthe housing 9-H removed therefrom.

FIG. 9-6A is a schematic view showing relative position of the frame9-F, the circuit board 9-P, and three electronic elements 9-G1 to 9-G3after assembly.

FIG. 9-6B is a cross-sectional view showing an L-shaped depressedsurface 9-F32′ of the frame 9-F adjacent to the housing 9-H, inaccordance with another embodiment of the disclosure.

FIG. 9-7 is a schematic view showing relative position of the magnets9-M, the coils 9-C, the holder 9-R, the circuit board 9-P, and threeelectronic elements 9-G1 to 9-G3 after assembly of the drivingmechanism.

FIG. 9-8 is a partial cross-sectional view showing a holder 9-R and anoptical element 9-E in accordance with another embodiment of thedisclosure.

FIG. 9-9 is an exploded view showing a frame 9-F, two magneticconductive members 9-Q, two magnets 9-M, a holder 9-R, and a coil 9-C inaccordance with another embodiment of the disclosure.

FIG. 9-10 is a cross-sectional view of the frame 9-F, the magneticconductive members 9-Q, the magnets 9-M, the holder 9-R, and the coil9-C in FIG. 9-9 after assembly.

FIG. 9-11 is an exploded view showing a frame 9-F and a hollow magneticconductive member 9-Q in accordance with another embodiment of thedisclosure.

FIG. 9-12 is an exploded view showing the frame 9-F and the magneticconductive member 9-Q in FIG. 9-11, two magnets 9-M, a holder 9-R, and acoil 9-C disposed on the holder 9-R.

FIG. 9-13 is a cross-sectional view of the frame 9-F, the magneticconductive member 9-Q, the magnets 9-M, the holder 9-R, and the coil 9-Cin FIG. 9-12 after assembly.

FIG. 9-14 is a schematic view showing relative position of a frame 9-F,an upper spring 9-S1, and four magnets 9-M after assembly of a drivingmechanism, in accordance with another embodiment of the disclosure.

FIG. 9-15 is a schematic view showing relative position of a frame 9-F,an upper spring 9-S1, and four magnets 9-M after assembly of a drivingmechanism, in accordance with another embodiment of the disclosure.

FIG. 9-16 is a cross-sectional view showing a holder 9-R, at least onelower spring 9-S2, and a base 9-B after assembly of a driving mechanism,in accordance with another embodiment of the disclosure.

DETAILED DESCRIPTION OF THE DISCLOSURE

The making and using of the embodiments of an electromagnetic drivingsystem are discussed in detail below. It should be appreciated, however,that the embodiments provide many applicable inventive concepts that canbe embodied in a wide variety of specific contexts. The specificembodiments discussed are merely illustrative of specific ways to makeand use the embodiments, and do not limit the scope of the disclosure.

Unless defined otherwise, all technical and scientific terms used hereinhave the same meaning as commonly understood by one of ordinary skill inthe art to which this disclosure belongs. It should be appreciated thateach term, which is defined in a commonly used dictionary, should beinterpreted as having a meaning conforming to the relative skills andthe background or the context of the present disclosure, and should notbe interpreted in an idealized or overly formal manner unless definedotherwise.

In the following detailed description of the preferred embodiments,reference is made to the accompanying drawings, and in which specificembodiments of which the disclosure may be practiced are shown by way ofillustration. In this regard, directional terminology, such as “top,”“bottom,” “left,” “right,” “front,” “back,” etc., is used with referenceto the orientation of the figures being described. The components of thepresent disclosure can be positioned in a number of differentorientations. As such, the directional terminology is used for thepurposes of illustration and is in no way limiting.

FIG. 1-1 is an exploded view of a lens module 1-10 in accordance with anembodiment of the disclosure. It should be noted that the lens module1-10 may be provided in handheld digital products such as mobile phonesor tablet PCs. The lens module 1-10 primarily comprises a drivingmechanism and an optical element 1-E received therein. In thisembodiment, the driving mechanism may comprise a voice coil motor (VCM),and the optical element 1-E may comprise an optical lens, so as toachieve auto-focus (AF) function of the lens module 1-10.

As shown in FIG. 1-1, the driving mechanism primarily comprises ahousing 1-H, a frame 1-F, an upper spring 1-S1, at least a lower spring1-S2, a base 1-B, a holder 1-R, a circuit board 1-P, at least alongitudinal magnet 1-M, and at least a coil 1-C corresponding to themagnet 1-M. The holder 1-R is connected to the frame 1-F and the base1-B via the upper and lower springs 1-S1 and 1-S2 (resilient elements),so that the holder 1-R can be suspended in the housing 1-H. The opticalelement 1-E is affixed in the holder 1-R, and the magnet 1-M and thecoil 1-C can constitute a driving assembly for driving the holder 1-Rand the optical element 1-E to move along an optical axis 1-O of theoptical element 1-E, so as to achieve auto-focus (AF) of the lens module1-10.

In this embodiment, two multipolar magnets 1-M and two coils 1-C aredisposed in the driving mechanism. Each magnet 1-M comprises twomagnetic units 1-M1 and 1-M2 having opposite polar directions. The twocoils 1-C have an oval-shaped structure and are affixed to oppositesides of the holder 1-R, corresponding to the magnets 1-M. In someembodiments, the length of the magnet 1-M along a longitudinal axisthereof (Y axis) is greater than that of the coil 1-C along thelongitudinal axis (Y axis). When a current is applied to the coil 1-C,an electromagnetic force can be generated between the coil 1-C and themagnet 1-M to drive the holder 1-R and the optical element 1-E to movealong the optical axis 1-O (Z axis).

FIG. 1-2 is a schematic view of the lens module 1-10 in FIG. 1-1 afterassembly with the optical element 1-E removed, FIG. 1-3 is across-sectional view taken along line 1A1-1A1 in FIG. 1-2, and FIG. 1-4is a schematic view of the driving mechanism of FIG. 1-2 with thehousing 1-H removed. Referring to FIGS. 1-1 to 1-4, the housing 1-H maycomprise metal or plastic material and is affixed to the base 1-B. Theframe 1-F, the upper spring 1-S1, two lower springs 1-S2, the holder1-R, the circuit board 1-P, the magnets 1-M, and the coils 1-C arereceived in a space between the housing 1-H and the base 1-B. The frame1-F is affixed to an inner surface of the housing 1-H, the magnets 1-Mare affixed to a lower surface of the frame 1-F, and the upper and lowersprings 1-S1 and 1-S2 are connected to the frame 1-F and the base 1-B,respectively.

It should be noted that the circuit board 1-P has an L-shaped structure,and at least a first terminal 1-P1 and at least a second terminal 1-P2are provided on a lower side of the circuit board 1-P. Here, a pluralityof first terminals 1-P1 are provided and can be electrically connectedto an external circuit, and a plurality of second terminals 1-P2 areprovided and can be electrically connected to the conductive pins 1-B2(FIG. 1-1) on the base 1-B by soldering. Another two conductive pins1-B1 protruding from the base 1-B are electrically connected to theconductive pins 1-B2, and the two lower springs 1-S2 can be electricallyconnected to the conductive pins 1-B1 by soldering, and the conductivepins 1-B1 can electrically connect to the coils 1-C on the holder 1-Rvia conductive wires (not shown). Thus, the external circuit can providea current to the coils 1-C and drives the holder 1-R and the opticalelement 1-E to move along the optical axis 1-O (Z axis).

FIGS. 1-5 and 1-6 are schematic views of the frame 1-F in FIG. 1-4.Referring to FIGS. 1-4 to 1-6, the frame 1-F has a quadrilateralstructure, and the circuit board is extended from a first side of theframe 1-F to a second side of the frame 1-F, wherein the second side isadjacent to the first side (FIG. 1-4). Here, the first terminals 1-P1and the second terminals 1-P2 are respectively located on the first andsecond sides of the frame 1-F. It should be noted that the frame 1-F andthe holder 1-R may comprise plastic material, wherein the frame 1-Fforms a stop surface 1-F3 on the inner side thereof and parallel to theoptical axis 1-O (Z axis). Hence, when the lens module 1-10 is impactedby an external force, the stop surface 1-F3 of the frame 1-F can contactand restrict the holder 1-R in a limit position along horizontaldirections, so as to prevent the electronic components on the circuitboard 1-P from being damaged by the holder 1-R.

As shown in FIGS. 1-1 and 1-4, the circuit board 1-P forms a depressedportion 1-P3 for receiving the magnet 1-M, and the circuit board 1-P andthe magnet 1-M at least partially overlap in a direction parallel to theoptical axis 1-O (Z axis). Thus, the dimensions of the lens module 1-10can be reduced to achieve miniaturization of the lens module 1-10. FIGS.1-4 to 1-6 show that the frame 1-F has two pair of protrusions 1-F1extending toward the base 1-B, wherein the end portions of theprotrusions 1-F1 are separated from and not connected to each other.Furthermore, a recess 1-F10 is formed between two of the protrusions1-F1 for accommodating and positioning the magnet 1-M on the frame 1-F.As depicted in FIG. 1-4, two protrusions 1-F1 are received in thedepressed portion 1-P3 for positioning the magnet 1-M during assembly ofthe driving mechanism.

FIG. 1-7 is a schematic view of the driving mechanism in FIG. 1-2 withthe housing 1-H and the circuit board 1-P removed, and FIG. 1-8 is across-sectional view taken along line 1A2-1A2 in FIG. 1-2. Referring toFIGS. 1-7 and 1-8, the driving mechanism in this embodiment furthercomprises an integrated circuit element 1-G1, a displacement sensingelement 1-G2, and a filter element 1-G3 disposed on an inner surface ofthe circuit board 1-P. The frame 1-F forms a pair of protrusions 1-F2extending toward the base 1-B, and the integrated circuit element 1-G1is received in a recess 1-F20 formed between the protrusions 1-F2. Asshown in FIG. 1-8, the stop surface 1-F3 is closer to the holder 1-Rthan the integrated circuit element 1-G1, to protect and restrict theintegrated circuit element 1-G1 in a safe position. It should be notedthat the end portions of the protrusions 1-F1 and F2 are higher andcloser to a light incident side of the optical axis 1-O (Z axis) thanthe bottom surface of the holder 1-R (FIG. 1-7).

Still referring to FIG. 1-7, the integrated circuit element 1-G1 islocated between the displacement sensing element 1-G2 and the filterelement 1-G3. The magnet 1-M is situated on a first side of the frame1-F, and the integrated circuit element 1-G1, the displacement sensingelement 1-G2, and the filter element 1-G3 are situated on a second sideof the frame 1-F, adjacent to the first side. For example, thedisplacement sensing element 1-G2 may be a Hall effect sensor, MRsensor, or Fluxgate sensor which are located near a pair of magneticelements 1-D (such as magnets), so that the displacement of the holder1-R relative to the housing 1-H along the Z axis can be detected toachieve auto-focus (AF) function.

FIG. 1-9 is a cross-sectional view taken along line 1A3-1A3 in FIG. 1-2.Referring to FIGS. 1-6, 1-7, and 1-9, the frame 1-F in this embodimentforms a stage 1-F4 located at a corner of the frame 1-F and extendedtoward the base 1-B. During assembly, a bending portion of the circuitboard 1-P is received and restricted between the stage 1-F4 and thehousing 1-H, as shown in FIG. 1-9. Similarly, the base 1-B in thisembodiment also forms at least a stage B3 extending toward the frame 1-Fand corresponding to the stage 1-F4, wherein a bending portion of thecircuit board 1-P is received restricted between the stage B3 and thehousing 1-H during assembly, so that the circuit board 1-P can beprotected and positioned in a fixed position. In this configuration,efficient assembly and space utilization can be both implemented, andminiaturization of the lens module can also be achieved.

FIG. 2-1 is an exploded view of a driving mechanism in accordance withan embodiment of the disclosure. The driving mechanism may comprise avoice coil motor (VCM) and may be provided in handheld digital productssuch as mobile phones or tablet PCs. The driving mechanism can be usedto move an optical element received therein, so as to achieve auto-focus(AF) function.

As shown in FIG. 2-1, the driving mechanism primarily comprises ahousing 2-H, a frame 2-F, an upper spring 2-S1, two lower springs 2-S2,a base 2-B, a holder 2-R, a coil 2-C, and at least a longitudinal magnet2-M corresponding to the coil 2-C. The holder 2-R is connected to theframe 2-F and the base 2-B through the upper and lower springs 2-S1 and2-S2 (resilient elements), respectively, so that the holder 2-R issuspended in the housing 2-H. An optical element (not shown) such as anoptical lens is affixed in the holder 2-R, and the magnet 2-M and thecoil 2-C can constitute a driving assembly for driving the holder 2-Rand the optical element to move along an optical axis 2-O of the opticalelement.

FIG. 2-2 is a schematic view of the driving assembly in FIG. 2-1 afterassembly, and FIG. 2-3 is a cross-sectional view taken along the line2A1-2A1 in FIG. 2-2. Referring to FIGS. 2-1 to 2-3, the housing 2-Hcomprises metal or plastic material, and it is affixed to the base 2-Bto form a fixed module. The frame 2-F is affixed to an inner surface ofthe housing 2-H. The magnets 2-M and the outer portion of the upperspring 2-S1 are affixed to a bottom surface of the frame 2-F, and theinner portion of the upper spring 2-S1 is affixed to the holder 2-R. Inthis embodiment, when a current is applied to the coil 2-C, anelectromagnetic force can be generated between the coil 2-C and themagnets 2-M, so as to move the holder 2-R and the optical elementrelative to the housing 2-H and the base 2-B along the optical axis 2-O.

It should be noted that at least a conductive pin 2-P is embedded in thebase 2-B. The conductive pin 2-P is extended through the base 2-B toelectrically connect the lower spring 2-S2 with an external circuit. Insome embodiments, the conductive pin 2-P may connect to the lower spring2-S2 by soldering, and the lower spring 2-S2 may electrically connect tothe coil 2-C via a wire (not shown). Thus, the external circuit canprovide a current to the coil 2-C and drive the holder 2-R and theoptical element to move along the optical axis 2-O. For example, an endof the wire may be connected to the coil 2-C, and the other end of thewire may be wound around a leg 2-R1 of the holder 2-R. During assembly,the lower spring 2-S2 is bonded to the wire wound on the leg 2-R1 bysoldering or laser welding, so that the coil 2-C can be electricallyconnected to the external circuit.

As the area 2-S11 shows in FIG. 2-1, the upper spring 2-S1 forms atleast a thin deformable portion which has a wiggle structure.Specifically, the deformable portion connects the inner portion with theouter portion of the upper spring 2-S1, and it has at least threeparallel sections. In this embodiment, the deformable portion has fourparallel sections. When viewed along the optical axis 2-O, a diagonalline 2-S1′ of the upper spring 2-S1 is extended through the parallelsections. Additionally, at least a corner of the upper spring 2-S1 formsa recess 2-S12 to prevent interference between the housing 2-H and theupper spring 2-S1 during assembly.

FIG. 2-4 is a schematic view of one of the lower springs 2-S2 in FIG.2-1, FIG. 2-5 is a schematic view showing relative position of the twolower springs 2-S2 and the base 2-B in FIG. 2-1 after assembly, FIG. 2-6is a top view of the lower springs 2-S2, the base 2-B, the holder 2-R,and the coil 2-C in FIG. 2-1 after assembly, and FIG. 2-7 is a partialenlarged view of the lower spring 2-S2, the base 2-B, the holder 2-R,and the coil 2-C after assembly. Referring to FIG. 2-4, the lower spring2-S2 may comprise metal and have two connection portions 2-SB1, 2-SB2connected to the base 2-B, two deformable portions 2-S24, and twoconnection portions 2-SR1, 2-SR2 connected to the holder 2-R. The twoconnection portions 2-SB1, 2-SB2 may be affixed at two adjacent cornersof the base 2-B by glue. The connection portions 2-SR1, 2-SR2respectively have a through hole 2-h 1, wherein two protruding columnsof the holder 2-R are extended through the holes 2-h 1 and adhered tothe connection portions 2-SR1, 2-SR2 during assembly. The two thindeformable portions 2-S24 respectively connect the connection portions2-SB1, 2-SB2 with the connection portions 2-SR1, 2-SR2, so that theholder 2-R can be suspended in the housing 2-H.

It should be noted that the lower spring 2-S2 further has a narrowportion 2-S21 and an end portion 2-S22. The end portion 2-S22 can beelectrically connected to the wire wound on the leg 2-R1 by laserwelding. The narrow portion 2-S21 is formed between connection portion2-SR1 and the end portion 2-S22, so as to prevent insufficient weldingtemperature owing to the rapid heat conduction of the lower spring 2-S2during the welding process. In this embodiment, the end portion 2-S22comprises a hollow structure and forms a through hole 2-h 2, wherein thenarrow portion 2-S21 is close to the through holes 2-h 1 and 2-h 2.

As shown in FIGS. 2-6 and 2-7, the leg 2-R1 is extended from an outersurface of the holder 2-R, and it at least partially overlaps with theend portion 2-S22 of the lower spring 2-S2 along the optical axis 2-O (Zaxis) of the optical element. Thus, a part of the wire wound on the leg2-R1 is located between the end portion 2-S22 and the leg 2-R1, and theend portion 2-S22 can be easily bonded to the wire on the leg 2-R1 bysoldering or laser welding.

Referring to FIGS. 2-4 and 2-7, at least a longitudinal recess 2-N isformed on the connection portion 2-SB2 of the lower spring 2-S2. Here,the recess 2-N is located at an edge of the lower spring 2-S2 andadjacent to a corner of the base 2-B. It should be noted that the gluecan be applied between the base 2-B and the lower spring 2-S2 duringassembly, and the recess 2-N can accommodate and guide the glue, so asto prevent overflow of the glue when the lower spring 2-S2 is pressed bya fixture.

FIG. 2-8 is a cross-sectional view taken along the line 2A2-2A2 in FIG.2-6. As shown in FIGS. 2-4 and 2-8, the lower spring 2-S2 forms anopening 2-G having a bonding area 2-G1 and an extension area 2-G2,wherein the extension area 2-G2 is extended from the bonding area 2-G1.During assembly, a solder paste can be disposed in the bonding area 2-G1to electrically connect the resilient element 2-S2 with the conductivepin 2-P embedded in the base 2-B. As the extension area 2-G2 is formedbeside the bonding area 2-G1, the solder is exposed to and can be seenfrom a side of the extension area 2-G1. Namely, the extension area 2-G2can be used as a window for observing and inspecting the solder, so thatnon-wetting of the solder can be prevented, and robust bonding betweenthe soldering and the conductive pin 2-P can be ensured.

FIG. 2-9 is a schematic view of a lower spring 2-S2 in accordance withanother embodiment of the disclosure. The lower spring 2-S2 in FIG. 2-9differs from FIG. 2-4 in that it does not have the opening 2-G, and theend portion 2-S22 of the lower spring 2-S2 has a stick-shaped structure,thus facilitating manual soldering and positioning during the assemblyprocess. FIG. 2-9 further shows that at least a narrow portion 2-S21 isformed between the connection portion 2-SR1 and the end portion 2-S22,so that insufficient welding temperature owing to the rapid heatconduction of the lower spring 2-S2 during the soldering or weldingprocess can be avoided.

FIG. 2-10 is an exploded view showing a holder 2-R, a coil 2-C, a wire2-W, two lower springs 2-S2, a base 2-B, and two conductive pins 2-P inaccordance with another embodiment of the disclosure, FIG. 2-11 is aschematic view of the holder 2-R, the coil 2-C, the wire 2-W, the lowersprings 2-S2, the base 2-B, and the conductive pins 2-P in FIG. 2-10after assembly, and FIG. 2-12 is a partial enlarged view of the holder2-R, the coil 2-C, the wire 2-W, the lower spring 2-S2, and the base 2-Bin FIG. 2-11. It should be noted that the holder 2-R, the coil 2-C, thewire 2-W, the lower springs 2-S2, the base 2-B, and the conductive pins2-P in FIGS. 2-10 to 2-12 can replace the corresponding elements in FIG.2-1 to constitute a driving mechanism for moving an optical element(such as optical lens) received therein, so as to achieve auto-focus(AF) function.

As shown in FIG. 2-12, the wire 2-W is electrically connected to thecoil 2-C, and an end of the wire 2-W is wound around the leg 2-R1 of theholder 2-R. During assembly, the end portion 2-S22 of the lower spring2-S2 is bonded to the wire on the leg 2-R1 by soldering or laserwelding, so that the coil 2-C can be electrically connected to anexternal circuit. Still referring to FIG. 2-12, the base 2-B forms acolumn 2-B1 extended through the lower spring 2-S2, wherein the glue canbe disposed between the column 2-B1 and the lower spring 2-S2 to enhancethe adhesion strength. In some embodiments, the column 2-B1 and thelower spring 2-S2 can also be bonded to each other by ultrasonic weldingor hot pressing.

FIG. 2-13 is a partial enlarged view showing a corner of the base 2-B,and FIG. 2-14 is an enlarged cross-sectional view showing a column 2-B1of the base 2-B extended through the lower spring 2-S2. Referring toFIGS. 2-13 and 2-14, the base 2-B forms an annular channel 2-B2surrounding the column 2-B1. The column 2-B1 and the channel 2-B2 canconstitute a positioning structure to facilitate close-fittingconnection between the lower spring 2-S2 and an adhesion surface 2-B3 ofthe base 2-B. Since the channel 2-B2 is lower than the adhesion surface2-B3, it can be used to receive and guide the glue, so that overflow ofthe glue can be efficiently avoided. As shown in FIG. 2-14, a gap isformed between the column 2-B1 and the lower spring 2-S2 along thehorizontal direction, and the lower spring 2-S2 protrudes from an edgeof the adhesion surface 2-B3 to cover a part of the channel 2-B2, sothat the glue can be guided along the column 2-B1 to the upper surfaceof the lower spring 2-S2 to enhance the connection strength between thebase 2-B and the lower spring 2-S2.

FIG. 2-15 is a partial enlarged view showing the holder 2-R, the coil2-C, and the lower spring 2-S2 in FIG. 2-10 after assembly. Referring toFIGS. 2-10 and 2-15, the bottom of the holder 2-R forms at least acolumn 2-R2 and at least a protrusion 2-R3, and the lower spring 2-S2forms a longitudinal slot 2-h 3, wherein the slot 2-h 3 and theprotrusion 2-R3 are close to the column 2-R2. As shown in FIG. 2-15, thecolumn 2-R2 is extended through the lower spring 2-S2, and the glue canbe disposed between the column 2-R2 and the lower spring 2-S2 to firmlyconnect the lower spring 2-S2 with the holder 2-R.

In some embodiments, the holder 2-R may have a channel (as well as thechannel 2-B2 shows in FIG. 2-14) surrounding the column 2-R2, tofacilitate close-fitting connection between the lower spring 2-S2 andthe holder 2-R. In some embodiments, the column 2-B2 and the lowerspring 2-S2 can also be bonded to each other by ultrasonic welding orhot pressing. It should be noted that since the slot 2-h 3 and theprotrusion 2-R3 are both located close to the column 2-R2, the gluearound the column 2-R2 can be efficiently guided along the edges of theslot 2-h 3 and the protrusion 2-R3, so that overflow of the glue can beefficiently avoided. Additionally, the protrusion 2-R3 can also be usedas a positioning structure during assembly, thus improving assemblyaccuracy and efficiency of the driving mechanism.

FIG. 2-16 is a partial enlarged view showing a holder 2-R, a coil 2-C,and a lower spring 2-S2 in accordance with another embodiment of thedisclosure. Referring to FIG. 2-16, the holder 2-R has a leg 2-R1 with awire (not shown) wound thereon. The lower spring 2-S2 has a connectionportion 2-SR1 and an end portion 2-S22 protruding from the connectionportion 2-SR1. In this embodiment, the connection portion 2-SR1 isaffixed to the holder 2-R and forms a longitudinal slot 2-h 3 (such as ahole extended through the lower spring 2-S2). Additionally, a throughhole 2-h 2 is formed on the end portion 2-S22.

It should be noted that a column 2-R2 is located close to slot 2-h 3 andextended through the lower spring 2-S2. In some embodiments, the holder2-R may have a channel (as well as the channel 2-B2 shows in FIG. 2-14)surrounding the column 2-R2, so as to facilitate close-fittingconnection between the lower spring 2-S2 and the holder 2-R. Duringassembly, the glue is disposed between the column 2-R2 and the lowerspring 2-S2, and the end portion 2-S22 and the wire (not shown) wound onthe leg 2-R1 can be electrically connected by laser welding.

Since the slot 2-h 3 is close to the column 2-R2, when the glue spillsfrom the periphery of the column 2-R2, the slot 2-h 3 can guide the glueto flow along the edge thereof, thus preventing the mechanism beingdamaged due to overflow of the glue. Additionally, since the slot 2-h 3is also close to the end portion 2-S22, insufficient welding temperatureowing to the rapid heat conduction of the lower spring 2-S2 during thewelding process can also be avoided. It should be noted that thestructures of the slot 2-h 3 and the protrusion 2-R3 shown in FIGS. 2-15and 2-16 can also be respectively applied to the lower spring 2-S2 andthe base 2-B, so that the glue can be guided by them to prevent overflowof the glue, and assembly efficiency and production yield can betherefore improved.

FIG. 2-17 is a schematic view of a frame 2-F in accordance with anotherembodiment of the disclosure, FIG. 2-18 is a partial cross-sectionalview showing a depressed portion 2-F2 of the frame 2-F in FIG. 2-17which is spaced apart from an inner surface of a housing 2-H afterassembly, and FIG. 2-19 is a partial cross-sectional view showing arecess 2-F3 of the frame 2-F in FIG. 2-17 which is spaced apart from aninner surface of a housing 2-H after assembly. It should be noted thatthe frame 2-F in FIG. 2-17 can replace the corresponding element in FIG.2-1, and it has four abutting surfaces 2-F1 on the four sides thereof.During assembly of the driving mechanism, the glue can be disposedbetween the abutting surfaces 2-F1 and the inner surface of the housing2-H, to achieve both accuracy positioning and robust adhesion betweenthe frame 2-F and the housing 2-H. Specifically, the frame 2-F forms adepressed portion 2-F2 depressed toward the center of the frame 2-F anda recess 2-F3 extended along the Z axis. The depressed portion 2-F2(FIG. 2-18) can reduce the interference between the frame 2-F and thehousing 2-H during assembly. The recess 2-F3 (FIG. 2-19) can be used asa flow channel to receive and guide the glue, so as to increase theadhesive area between the frame 2-F and the housing 2-H and preventoverflow of the glue.

FIG. 2-20 is a schematic view of a holder 2-R, a coil 2-C, and at leastone wire after assembly, in accordance with another embodiment of thedisclosure. Referring to FIG. 2-20, the holder 2-R and the coil 2-C canreplace the corresponding elements in FIG. 2-1, wherein two oval-shapedcoils 2-C are disposed on opposite sides of the holder 2-R and locatedcorresponding to the magnets 2-M (e.g. multipolar magnets) shown in FIG.2-1. An end of the wire 2-W is connected to one of the coils 2-C, andthe other end of the wire 2-W is wound on the leg 2-R1. Specifically,the holder 2-R has a recessed portion 2-R′, and at least a part of theleg 2-R1 is received in the recessed portion 2-R. Thus, the dimensionsof the holder 2-R in the horizontal directions can be efficientlyreduced to achieve miniaturization of the driving mechanism.

FIGS. 2-21 and 2-22 are schematic views showing relative position of aholder 2-R and a frame 2-F of a driving mechanism after assembly, inaccordance with another embodiment of the disclosure. Referring to FIGS.2-21 and 2-22, the holder 2-R forms at least a protrusion 2-R4protruding from an outer surface of the holder 2-R, and the frame 2-Fforms at least a protrusion 2-F4 corresponding to the protrusion 2-R4.It should be noted that when the driving mechanism is impacted by anexternal force, the holder 2-R may rotate with respect to the frame 2-F,as indicated by the arrows in FIG. 2-22. In this circumstance, theprotrusion 2-F4 of the frame 2-F can contact the protrusion 2-R4 of theholder 2-R, so that the holder 2-R can be restricted in a limitposition. Thus, the upper and lower springs 2-S1 and 2-S2 of the drivingmechanism can be protected from damage due to excessive rotation of theholder 2-R.

Referring to FIGS. 3-1 to 3-3, FIG. 3-1 is a perspective view of adriving mechanism 3-1 according to an embodiment of the presentdisclosure, FIG. 3-2 is an exploded view of the driving mechanism 3-1 inFIG. 3-1, FIG. 3-3 is a cross-segmental view along line 3A-3A′ in FIG.3-1. It should be noted that the driving mechanism 3-1 of the presentembodiment is for holding an optical member (not shown, such as a lens),and a driving module may be disposed in the driving mechanism 3-1, suchas a voice coil motor (VCM) optical image stabilization (OIS) or autofocus (AF) functions.

As shown in FIGS. 3-1 to 3-3, in this embodiment, the driving mechanism3-1 mainly includes a case 3-10, a base 3-20, a holder 3-30, a firstmagnetic driving component 3-40, a frame 3-50, a plurality of secondmagnetic driving components 3-60, a first elastic member 3-70, a secondelastic member 3-72, a circuit board 3-80, and a metal circuit 3-90. Inthis embodiment, the shape of the driving mechanism 3-1 is a square.

The case 3-10 can be combined with the base 3-20 to form a housing forthe driving mechanism 3-1. It should be noted that a case opening 3-12and a base opening 3-22 are respectively formed on the case 3-10 and thebase 3-20. The center of the case opening 3-12 is located at an opticalaxis 3-O of an optical member (not shown). The base opening 3-22corresponds to an image sensor (not shown) placed outside the drivingmechanism 3-1. Accordingly, the optical member in the driving mechanism3-1 can perform image focusing with the image sensor in the direction ofthe optical axis 3-O.

The holder 3-30 has a through hole 3-32, wherein the optical member canbe fixed in the through hole 3-32 (e.g. by securing, adhering, etc.).The frame 3-50 is disposed in the case 3-10 and the base 3-20, and theholder 3-30 is disposed in the frame 3-50. The first magnetic drivingcomponent 3-40 is, for example, a coil wound around the outer surface ofthe holder 3-30. The second magnetic driving components 3-60 are, forexample, magnetic members disposed at corners of the driving mechanism3-1. A magnetic force may be generated by the interaction between thesecond magnetic driving components 3-60 and the first magnetic drivingcomponent 3-40 to move the holder 3-30 relative to the frame 3-50 alongthe optical axis 3-O, thereby achieving fast focusing.

In this embodiment, the holder 3-30 and the optical member therein aremovably disposed in the frame 3-50. More specifically, the holder 3-30is suspended in the frame 3-50 by the first elastic member 3-70 and thesecond elastic member 3-72 made of a metal material (FIG. 3). When acurrent is supplied to the first magnetic driving component 3-40, thefirst magnetic driving component 3-40 can act with the magnetic field ofthe second magnetic driving components 3-60 to generate anelectromagnetic force to move the holder 3-30 and the optical membertherein along the optical axis 3-O direction with respect to the frame3-50 to achieve auto focusing. For example, the second magnetic drivingcomponents 3-60 may include at least one multipole magnet which is usedto electromagnetically act with the first magnetic driving component3-40 to move the holder 3-30 and the optical member along the opticalaxis 3-O so as to perform image focusing.

The circuit board 3-80, such as a flexible printed circuit board (FPC),may be fixed to the base 3-20 by adhesion. In this embodiment, thecircuit board 3-80 is electrically connected to a driving unit (notshown) placed outside the driving mechanism 3-1 to perform functionssuch as AF or OIS.

In this embodiment, a position sensor 3-81 for detecting a sensed object3-82 is disposed on and is electrically connected to the circuit board3-80, thereby detecting the location offset of the frame 3-50 and theholder 3-30 with respect to the base 3-20. The position sensor 3-81 maybe, for example, a Hall effect sensor, a MR sensor or a fluxgate, etc.,and the sensed object 3-82 may be a magnetic member.

In this embodiment, the metal circuit 3-90 may be disposed on the base3-20, such as be formed on or formed in the base 3-20 by insert moldingor molded interconnect object technology, such as laser directstructuring (LDS), microscopic integrated processing technology(MIPTEC), laser induced metallization (LIM), laser restructuring print(LRP), aerosol jet process, or two-shot molding method, etc.

It should be realized that the circuit board 3-80 may transmitelectrical signals to the metal circuit 3-90, and the circuit board 3-80may also transmit electrical signals to the first magnetic drivingcomponent 3-40 through the first elastic member 3-70, therebycontrolling the movement of the holder 3-30 along the X-axis, Y-axis3-Or Z-axis.

Referring to FIGS. 3-4A to 3-4C, which are a perspective view, anexploded view and a cross-segmental view of a driving mechanism 3-2according to another embodiment of the present disclosure, respectively.The driving mechanism 3-2 mainly includes a case 3-100, a plurality ofsecond magnetic driving components 3-110, a first elastic member 3-120,a holder 3-130, a first magnetic driving component 3-135, a secondelastic member 3-140, and a bottom 3-150. It should be noted that someelements which are the same or similar as those of the driving mechanism3-1 are omitted herein. The difference between the driving mechanism 3-2in this embodiment and the driving mechanism 3-1 in the previousembodiment is that the length of two adjacent sides of the drivingmechanism 3-2 are not equal. In other words, the driving mechanism 3-2is not a square.

Referring to FIG. 3-5A, which is a top view of the case 3-100 of thedriving mechanism 3-2. The case 3-100 includes a first side 3-101 and asecond side 3-102 having a first length 3-L1 and a second length 3-L2,respectively. In this embodiment, the first length 3-L1 is greater thanthe second length 3-L2. In other words, the case 3-100 of the drivingmechanism 3-2 is a rectangle. Through arranging the driving mechanism3-2 as a rectangle, dimension of the driving mechanism 3-2 along thesecond side 3-102 may be effectively reduced to achieve mechanicalminiaturization.

In FIG. 3-5A, a plurality of protruding first positioning parts 3-103are formed on the first side 3-101 of the case 3-100, a plurality ofprotruding second positioning parts 3-104 are formed on the second side3-102. The material of the case 3-100 is, for example, plastic, and thecase 3-100, the first positioning parts 3-103, and the secondpositioning parts 3-104 are integrally formed as one piece by, forexample, plastic injection. As a result, as shown in FIGS. 3-5B and3-5C, the trapezoidal first magnetic driving components 3-110 may bedisposed at the corners of the case 3-100, and a first corner 3-111 anda second corner 3-112 of the first magnetic driving component 3-110 abutthe first positioning part 3-103 and the second positioning part 3-104,respectively. As a result, the first magnetic driving components 3-110may be fixed at the corners of the case 3-100 by the first side 3-101,the second side 3-102, the first positioning part 3-103, and the secondpositioning part 3-104, thereby enhancing the accuracy of assembly andthe mechanical strength of the driving mechanism 3-2. Furthermore, thematerial of the case 3-100 is plastic, signal of a mobile device may notbe interfered, and therefore quality and stability of communication maybe enhanced.

Referring to FIGS. 3-6A to 3-6C, which are top views of the firstelastic member 3-120 of the driving mechanism 3-2. The first elasticmember 3-120 is mainly formed by a first outer circumferential part3-121A, a second outer circumferential part 3-121B and an innercircumferential part 3-122. The first outer circumferential part 3-121Aand the second outer circumferential part 3-121B are connected by acorner part 3-123. Two first strings 3-124 and two second strings 3-125are disposed between first, second circumferential parts 3-121A, 3-121Band the inner circumferential part 3-122 in an alternate manner. Itshould be noted that the area in a top view (e.g. FIG. 3-6A) and thestructure of the first strings 3-124 and the second strings 3-125 aredifferent. Furthermore, the two first strings 3-124 are symmetric withrespect to the optical axis 3-O of the optical member (not shown), suchas rotational symmetry or reflectional symmetry, and so as the twosecond strings 3-125. Unwanted tilting of the holder 3-130 may bereduced during moving by the first strings 3-124 and the second strings3-125 having different characteristics, and is especially effective inthe asymmetric driving mechanism 3-2 in this embodiment. Furthermore,elastic coefficients of the first strings 3-124 and the second strings3-125 may be adjusted separately using this method, thereby achievingdifferent characteristic requirements.

In this embodiment, axis 3-C1 is where the centers of two oppositesecond sides 3-102 of the case 3-100 are connected, and axis 3-C2 iswhere the centers of two opposite first sides 3-101 of the case 3-100are connected. In other words, axis 3-C1 is parallel to the first side3-101, axis 3-C2 is parallel to the second side 3-102, and axes 3-C1 and3-C2 intersect at the optical axis 3-O of the optical member. A firstcurved part 3-126 and a second curved part 3-127 are arranged at thefirst, second circumferential parts 3-121A, 3-121B of the first elasticmember 3-120, and are deviated from the axes 3-C1, 3-C2, respectively.As shown in FIGS. 3-6B and 3-6C, the first curved part 3-126 and thesecond curved part 3-127 of the first elastic member 3-120 abut thefirst positioning part 3-103 and the second positioning part 3-104,respectively. As a result, a positioning function may be performedduring assembly, thereby increasing accuracy of assembly. However, thepresent disclosure is not limited thereto. For example, other elementsmay be disposed at the first, second curved parts 3-126, 3-127.

Two first connecting sites 3-128 and two second connecting sites 3-129are further disposed at the inner circumferential part 3-122 of thefirst elastic member 3-120. The first strings 3-124 and the secondstrings 3-125 are connected to the inner circumferential part 3-122through the first connecting sites 3-128 and the second connecting sites3-129, respectively. The axis 3-C1 pass through two second connectingsites 3-129, but the axis 3-C2 does not pass through the firstconnecting site 3-128. In other words, the connection of the two secondconnecting sites 3-129 may be parallel to the first side 3-101.Furthermore, when the driving mechanism 3-2 facing impact, the first,second curved parts 3-126, 3-127 and the first, second connecting sites3-128, 3-129 may be deformed to absorb energy of the impact and thusdispersing the stress to protect the driving mechanism 3-2.

Referring to FIG. 3-7A, the first elastic member 3-120 and the holder3-130 of the driving mechanism 3-2 are illustrated therein. Twoprotruding first linking parts 3-131 and two protruding second linkingparts 3-132 are at outer sides of the holder 3-130, and the firstlinking parts 3-131 and the second linking parts 3-132 are correspondingto and directly connected to the first connecting sites 3-128 and thesecond connecting sites 3-129 of the first elastic member 3-120,respectively. It should be noted that an axis 3-C3 may pass through thetwo first linking parts 3-131 and the optical axis 3-O of the opticalmember, and the axis 3-C1 may pass through the two second linking parts3-132. In other words, the two first linking parts 3-131 are symmetricwith respect to the optical axis 3-O of the optical member disposed inthe holder 3-130, so as the two second linking parts 3-132, but thefirst linking parts 3-131 are deviated from the axis 3-C2. Furthermore,an angle 3-O between the axes 3-C1 and 3-C3 is not a right angle. Withthis arrangement, the space in the driving mechanism 3-2 may beeffectively utilized to achieve mechanism miniaturization.

The holder 3-130 further includes two first stopping parts 3-133 and twosecond stopping parts 3-134, arranged to be symmetric with respect tothe center of the holder 3-130 (i.e. symmetric with respect to theoptical axis 3-O of the optical member), respectively. As shown in FIG.3-7A, the first and second stopping parts 3-133, 3-134 are disposedclose to the corner parts 3-123, i.e. close to corners of the drivingmechanism 3-2. As a result, the space at the corner of the drivingmechanism 3-2 may be effectively utilized to achieve mechanismminiaturization.

Referring to FIG. 3-7B, the case 3-100 and the holder 3-130 areillustrated therein. The case 3-100 has first concave parts 3-105 andsecond concave parts 3-106 corresponding to the first linking parts3-131 and the second linking parts 3-132 of the holder 3-130. In a topview, a portion of the first linking parts 3-131 and a portion of thesecond linking parts 3-132 are exposed by the first concave parts 3-105and the second concave parts 3-106, respectively, thereby enhancing theconvenience during assembly. The first concave part 3-105 and the secondconcave part 3-106 are corresponding to the first linking part 3-131 andthe second linking part 3-132, an angle of a connection between the twofirst concave parts 3-105 and a connection between the second concaveparts 3-106 is also the angle 3-O which is not a right angle, somechanism miniaturization may be further achieved.

It should be noted that if any stopping parts are formed between thelinking parts of the holder 3-130, there may be at least two stoppingparts. However, it is also possible not to form any stopping partbetween the linking parts. For example, as shown in FIG. 3-7A, the firststopping part 3-133 and the second stopping part 3-134 are disposedbetween the first linking part 3-131 and the second linking part 3-132.

Referring to FIGS. 3-8A and 3-8B, which are a bottom view and aperspective view of some elements of the driving mechanism 3-2 accordingto an embodiment of the present disclosure, respectively. As shown inFIGS. 3-8A and 3-8B, the case 3-100 and the holder 3-130 when assembledare illustrated therein. A first magnetic driving component 3-135 iswound around the holder 3-130, and the holder 3-130 has a plurality ofprotruding parts 3-136, which are protruding toward the second side3-102 of the case 3-100, and the holder 3-130 further has a plurality offirst positioning bumps 3-137, which are protruding parallel to theoptical axis 3-O, and the case 3-100 has recesses 3-107 corresponding tothe protruding parts 3-136. The protruding parts 3-136 are closer to thesecond sides 3-102 than to the first sides 3-101. Although the secondmagnetic driving component 3-110 is not shown in FIG. 3-8B, theprotruding parts 3-136 may be located between two second magneticdriving components 3-110 when the second magnetic driving components3-110 are disposed at the corners of the driving mechanism 3-2.

It should be noted that the first magnetic component 3-135 (the portiondefined by dashed line in FIG. 3-8A) may be formed from a first segment3-135A adjacent to the first side 3-101, a second segment 3-135Badjacent to the second side 3-102, and a third segment 3-135C adjacentto the corners of the case 3-100. The distance between the first side3-101 and the first segment 3-135A is 3-D1, and the distance between thesecond side 3-102 and the second segment 3-135B is 3-D2 which isdifferent from 3-D1. As a result, the space in the driving mechanism 3-2may be effectively utilized to achieve mechanism miniaturization.

Referring to FIG. 3-8C, which is a perspective view of the drivingmechanism 3-2 according to an embodiment of the present disclosure. Thesecond elastic member 3-140 having a plurality of first positioningholes 3-141 and a plurality of second positioning holes 3-142 is furtherdisposed on the holder 3-130. The first positioning bumps 3-137 of theholder 3-130 are disposed in the first positioning holes 3-141 of thesecond elastic member 3-140 to fix the relative positions of the holder3-130 and the second elastic member 3-140, thereby increasing theaccuracy of assembly. The second elastic member 3-140 has an end 3-143corresponding to the protruding part 3-136. As a result, the firstmagnetic driving component 3-135 (FIG. 3-4B) wound around the holder3-130 may be wound around the protruding part 3-136 and the end 3-143,and they may be fixed by soldering and be electrically connected to thesecond elastic member 3-140. Furthermore, the protruding part 3-136 maybe used for limiting the moving of the holder 3-130 in the drivingmechanism 3-2, thereby preventing unwanted collision between theelements.

Referring to FIGS. 3-9A to 3-9D, an assembly method of the drivingmechanism 3-2 is illustrated therein. As shown in FIG. 3-9A, the firstmagnetic driving component 3-135 is wound around the holder 3-130, andthe first magnetic driving component 3-135 and the holder 3-130 aredisposed on the second elastic member 3-140, wherein the firstpositioning bumps 3-137 of the holder 3-130 (FIGS. 3-8B and 3-8C) areconnected to the first positioning holes 3-141 of the second elasticmember 3-140 by, for example, engaging or adhesion. And then as shown inFIG. 3-9B, the holder 3-130 and the second elastic member 3-140 areassembled on the base 3-150, wherein the second positioning holes 3-142of the second elastic member 3-140 are connected to second positioningbumps 3-151 of the base 3-150 by, for example, engaging or adhesion,too. It should be noted that as shown in FIG. 3-9B, the secondpositioning bumps 3-151 are not disposed at every corners of the base3-150, thereby not every corners of the second elastic member 3-140 hasthe second positioning holes 3-142, and their amount may be varieddepending on design requirement.

Afterwards, as shown in FIG. 3-9C, the case 3-100, the second magneticdriving component 3-110 and the first elastic member 3-120 are assembledtogether, wherein the first elastic component 3-120 is disposed betweenthe case 3-100 and the second magnetic driving component 3-110, and thefirst positioning parts 3-103 and the second positioning parts 3-104 arecorresponding to the first corners 3-111 and the second corners 3-112 ofthe second magnetic driving component 3-110. As a result, the secondmagnetic driving component 3-110 may be engaged at the corners of thecase 3-100, and the first elastic member 3-120 is sandwiched therein.Next, the case 3-100, the second magnetic driving component 3-110 andthe first elastic member 3-120 are fixed by adhesion, such as by usingthermal curable adhesives or UV curable adhesives, etc. At last, asshown in FIG. 3-9D, the case 3-100 is set on the base 3-150 and thenfixed by adhesion or engaging. As a result, the assembly of the drivingmechanism 3-2 is finished.

Referring to FIGS. 4-1 to 4-3B, wherein FIG. 4-1 is a schematicperspective view illustrating a driving mechanism 4-1 in accordance withan embodiment of the present disclosure, FIG. 4-2 is an exploded viewillustrating the driving mechanism 4-1 in FIG. 4-1, FIG. 4-3A is across-sectional view illustrating the driving mechanism 4-1 along line4A-4A′ in FIG. 4-1, and FIG. 4-3B is a cross-sectional view illustratingthe driving mechanism 4-1 along line 4B-4B′ in FIG. 4-1. It should benoted that, in this embodiment, the driving mechanism 4-1 may be, forexample, a voice coil motor (VCM), which may be disposed in theelectronic devices with camera function for driving an optical member(such as a lens), and can perform an autofocus (AF) function.

It is shown in FIG. 4-2 that the driving mechanism 4-1 has a substantialrectangular structure, which mainly includes a fixed portion 4-F, acarrier 4-30, a plurality of driving coils 4-40, a frame 4-50, aplurality of magnetic members 4-60, a first elastic member 4-70, asecond elastic member 4-72, a circuit board 4-80, and at least onesensing magnet 4-90. The fixed portion 4-F includes a housing 4-10 and abase 4-20, both of which may be assembled as a hollow case. The carrier4-30, the driving coils 4-40, the frame 4-50, the magnetic members 4-60,the first elastic member 4-70, the second elastic member 4-72, thecircuit board 4-80, and the sensing magnet 4-90 may be surrounded by thehousing 4-10, and thus may be contained in the case.

The housing 4-10 has a hollow structure, which includes a top wall4-10A, four sidewalls 4-10B, and an optical hole 4-O1. The center of theoptical hole 4-O1 corresponds to an optical axis 4-O of an opticalmember (such as a lens 4-L; see FIGS. 4-3A and 4-3B). An optical hole4-O2 is formed on the base 4-20, and the optical hole 4-O2 correspondsto an image-sensing member (not shown) disposed outside the drivingmechanism 4-1. The housing 4-10 is connected to the base 4-20.Therefore, the optical member (the lens 4-L) disposed in the drivingmechanism 4-1 can perform a focusing function with the image-sensingmember in the direction of the optical axis 4-O. It should be noted thatthe term “the optical axis 4-O direction” may represent the directionthat is along the optical axis 4-O or any direction which is parallel tothe optical axis 4-O in the following description.

The base 4-20 includes a body 4-201 and a three-dimensional circuit4-202. For example, the body 4-201 is a plastic material, and thethree-dimensional circuit 4-202 is a metallic material. In thisembodiment, the three-dimensional circuit 4-202 is electricallyconnected to a circuit unit (not shown) disposed outside the drivingmechanism 4-1 through the circuit board 4-80, and the three-dimensionalcircuit 4-202 is configured to perform an autofocus (AF) function. Inaddition, the body 4-201, which is a plastic material, covers an outsideof the three-dimensional circuit 4-202 by insert molding.

The carrier 4-30 carries an optical member. The carrier 4-30 has ahollow structure, and a through hole 4-32 is formed therein, wherein theoptical member is secured in the through hole 4-32. The frame 4-50 hasan opening 4-52, and a groove 4-50A, wherein the circuit board 4-80 maybe fixed in the groove 4-50A. In this embodiment, the circuit board 4-80is electrically connected to the circuit unit (not shown) disposedoutside the driving mechanism 4-1. The circuit board 4-80 iselectrically connected to the driving coils 4-40 through thethree-dimensional circuit 4-202, and the circuit board 4-80 transmitsthe electrical signals sent from the circuit unit to the driving coils4-40 to perform an autofocus (AF) function.

As shown in FIGS. 4-2 and 4-3A, the carrier 4-30 is movably connected tothe housing 4-10 and the base 4-20. To be more specific, the carrier4-30 may be connected to the frame 4-50 through the first elastic member4-70, the carrier 4-30 may also be connected to the base 4-20 throughthe second elastic member 4-72, and the first elastic member 4-70 andthe second elastic member 4-72 are metallic materials. Therefore, thecarrier 4-30 is movably suspended between the frame 4-50 and the base4-20.

Two magnetic members 4-60 and two corresponding driving coils 4-40,which are disposed outside the carrier 4-30, may constitute a drivingassembly 4-EM. When a current is applied to the driving coils 4-40, anelectromagnetic driving force may be generated by the driving coils 4-40and the magnetic members 4-60 to drive the carrier 4-30 and the opticalmember (such as the lens 4-L) to move along Z-axis direction (theoptical axis 4-O direction) relative to the base 4-20. Therefore, theautofocus (AF) function is performed.

As shown in FIG. 4-3B, a magnetic field sensing member 4-82, which iselectrically connected to the circuit board 4-80, may be disposed on thebase 4-20. The magnetic field sensing member 4-82 is, for example, aHall effect sensor, a magnetoresistive (MR) sensor, such as a giantmagnetoresistive (GMR) sensor or a tunnel magnetoresistive (TMR) sensor,or a fluxgate. The magnetic field sensing member 4-82 and the sensingmagnet 4-90 constitute a sensing assembly. By detecting the sensingmagnet 4-90, which is disposed on the carrier 4-30, the displacement ofthe carrier 4-30 in the Z-axis direction (the optical axis 4-Odirection) relative to the base 4-20 may be obtained. The circuit board4-80 and the driving assembly 4-EM are disposed on different sides ofthe driving mechanism 4-1. That way, electromagnetic interference may beavoided, and the interior space of the driving mechanism 4-1 may befully utilized.

Referring to FIG. 4-4A, FIG. 4-4A is a schematic view illustrating therelative positions between the carrier 4-30 and the base 4-20 afterassembly in accordance with an embodiment of the present disclosure. Asshown in FIG. 4-4A, the base 4-20 includes four positioning members4-24, which are respectively formed at four corners of the base 4-20,located outside the carrier 4-30. That is, the positioning members 4-24are farther away from the optical axis 4-O than the carrier 4-30. Theaccuracy of assembly between the carrier 4-30 and the base 4-20 may beincreased by the design of the positioning members 4-24.

Next, referring to FIG. 4-4B, FIG. 4-4B is an enlarged view illustratinga region 4-M in FIG. 4-4A. As shown in FIG. 4-4B, the distance betweenthe positioning member 4-24 and the carrier 4-30 is narrower in thedirection towards the base 4-20 (i.e. negative Z-axis direction). Thatis, between the positioning member 4-24 and the carrier 4-30, a firstdistance 4-D1 is greater than a second distance 4-D2, wherein the firstdistance 4-D1 is farther away from the base 4-20, and the seconddistance 4-D2 is closer to the base 4-20. Accordingly, during theassembly of the carrier 4-30 and the base 4-20, collision is lessgenerated to cause the members damaged. In this embodiment, an innersurface, facing the carrier 4-30 (that is, facing the optical axis 4-O),of the positioning member 4-24 is designed to have a lateral surface4-24A and an inclined surface 4-24B adjacent to each other. The lateralsurface 4-24A is farther away from the carrier 4-30 than the inclinedsurface 4-24B so that the first distance 4-D1 is greater than the seconddistance 4-D2. In some other embodiments, the positioning member 4-24may also be designed as a stair-like, step, or curved structure so thatthe first distance 4-D1 is greater than the second distance 4-D2 betweenthe positioning member 4-24 and the carrier 4-30.

FIG. 4-4C is an enlarged view illustrating the positioning member 4-24and the carrier 4-30 after assembly in accordance with anotherembodiment of the present disclosure. As shown in FIG. 4-4C, a dampingmember 4-P may be disposed between the positioning member 4-24 and thecarrier 4-30. The damping member 4-P concurrently contacts thepositioning member 4-24 and the carrier 4-30. Therefore, during theoperation of the driving mechanism 4-1, the carrier 4-30 may bestabilized sooner. At the same time, the positioning member 4-24 isdisposed at the corner of the driving mechanism 4-1 so that thestability of the mechanism can be further enhanced, and the goal ofminiaturization is achieved. It should be noted that, in thisembodiment, the damping member 4-P does not contact the driving assembly4-EM (i.e. the driving coil 4-40 and the magnet members 4-60).

Referring to FIGS. 4-5A and 4-5B, FIG. 4-5A is a schematic perspectiveview illustrating a driving mechanism 4-1′ in accordance with anotherembodiment of the present disclosure, and FIG. 4-5B is a schematicperspective view illustrating interior components of the drivingmechanism 4-1′ in FIG. 4-5A. The driving mechanism 4-1′ may includemembers the same as or similar to the driving mechanism 4-1, the same orsimilar members will be denoted as the same or similar numerals, and thedetailed description will be omitted. It should be noted that forclearly illustrating the interior structure of the driving mechanism4-1′, a housing 4-10′ of the driving mechanism 4-1′ is not shown in FIG.4-5B. The difference between the driving mechanism 4-1′ in thisembodiment and the driving mechanism 4-1 shown in FIG. 4-1 is that adriving assembly 4-EM′ of the driving mechanism 4-1′ includes a drivingcoil 4-40′ and four magnetic members 4-60′. The driving coil 4-40′ isdisposed around a carrier 4-30′, and the magnetic members 4-60′ arerespectively disposed at four corners of the driving mechanism 4-1′.

Next, referring to FIG. 4-5C, FIG. 4-5C is a partial cross-sectionalview illustrating the driving mechanism 4-1′ in FIG. 4-5A. As shown inFIG. 4-5C, the housing 4-10′ is disposed on the positioning member 4-24.The housing 4-10′ has a protruding bearing surface 4-14, facing thepositioning member 4-24 and protruding towards the base 4-20. Theprotruding bearing surface 4-14 is perpendicular to the Z-axis direction(the optical axis 4-O direction). There is a gap 4-G between theprotruding bearing surface 4-14 of the housing 4-10′ and the positioningmember 4-24. An adhesive is filled into the gap 4-G to bond the housing4-10′ and the base 4-20. The bearable pressure of the mechanism may beenhanced by forming the protruding bearing surface 4-14, which isperpendicular to the Z-axis direction, and corresponds to thepositioning member 4-24. Therefore, the driving mechanism 4-1′ may beargreater external strength and not be damaged.

Referring to FIG. 4-6A, FIG. 4-6A is a schematic perspective viewillustrating a driving mechanism 4-1″ in accordance with anotherembodiment of the present disclosure. The driving mechanism 4-1″ mayinclude members the same as or similar to the driving mechanisms 4-1 and4-1′, the same or similar members will be denoted as the same or similarnumerals, and the description will not be repeated. It should be notedthat a housing 4-10″ of the driving mechanism 4-1″ is made of aconductive material (such as metal), and has an extending portion 4-16.The extending portion 4-16 may extend to a bottom surface of a base 4-21of the driving mechanism 4-1″. The extending portion 4-16 is configuredto be electrically connected to a circuit unit outside the drivingmechanism 4-1″. In addition, the extending portion 4-16 may be used forgrounding so that the driving mechanism 4-1″ is electrically connectedto the exterior more easily, and the process can be further simplified.

Furthermore, the difference between the driving mechanism 4-1″ in FIG.4-6A and the driving mechanisms 4-1 and 4-1′ is that each of thepositioning members 4-25 has a trench 4-V, and a first groove 4-T1 and arecess portion 4-R are formed on the lateral side of the base 4-21. Asshown in FIG. 4-6B, the trench 4-V is located outside the positioningmember 4-25, and is adjacent to the housing 4-10″ (See FIG. 4-6A). Thetrench 4-V is provided for filling an adhesive to bond the base 4-21 andthe housing 4-10″. Arranging the trench 4-V may facilitate applying theadhesive, and provide space for the adhesive to flow. Simultaneously,the contact area between the adhesive and the base 4-21, the housing4-10″ may also be increased to enhance the bonding capacity.

FIG. 4-6C is a partial schematic perspective view illustrating the base4-21 in accordance with another embodiment of the present disclosure.The difference between FIGS. 4-6C and 4-6B is that the trench 4-Vextends towards a foot of the positioning member 4-25 to a top surface4-20U of the base 4-21, and the top surface 4-20U is perpendicular tothe optical axis 4-O direction (Z-axis direction). Therefore, thecontact area between the adhesive and the base 4-21, and that betweenthe adhesive and the housing 4-10″ may be further increased tostrengthen the bonding effect. It should be noted that, in thisembodiment, the trench 4-V has a curved profile so that more adhesivemay be filled into the corner, and bonding effect may be partiallystrengthened. In addition, the trench 4-V may be designed to havedifferent shapes or depths as required.

FIG. 4-6D is a partial schematic perspective view illustrating the base4-21 in FIG. 4-6B. The difference between FIGS. 4-6D and 4-6B is that itis observed from the base 4-21 in the optical axis 4-O direction (Z-axisdirection) in FIG. 4-6D, wherein the first groove 4-T1 and the recessportion 4-R formed on the lateral surface of the base 4-21 are adjacentto the housing 4-10″ (see FIG. 4-6A), and the recess portion 4-Rsurrounds the first groove 4-T1. In other words, when observed from thebase 4-21 in the optical axis 4-O direction, the width of the recessportion 4-R is greater than the width of the first groove 4-T1. That is,the area of the recess portion 4-R is greater than the area of the firstgroove 4-T1. When the adhesive is filled into the first groove 4-T1 andthe recess portion 4-R to bond the base 4-21 and the housing 4-10″, theadhesive is sequentially filled into the first groove 4-T1 and therecess portion 4-R. The adhesive would less overflow from the bottomsurface of the base 4-21 by forming the recess portion 4-R with agreater area on the first groove 4-T1. Thus, the driving mechanism 4-1″is assembled on general electronic devices with a camera or videofunction without any interference.

Then, referring to FIG. 4-7A, FIG. 4-7A is a partial schematicperspective view illustrating a base 4-22 in accordance with anotherembodiment of the present disclosure. The difference between the base4-22 in this embodiment and the base 4-21 shown in FIG. 4-6B is that thebase 4-22 further includes a base plate 4-20A and a wall 4-20B. The wall4-20B is formed on the base plate 4-20A, and abuts the housing 4-10 (seeFIGS. 4-7B and 4-7C). As shown in FIG. 4-7A, a second groove 4-T2 isformed on the base plate 4-20A, located outside the wall 4-20B, and isadjacent to the housing 4-10. When an adhesive is applied to bond thebase 4-22 and the housing 4-10, the adhesive flows along the secondgroove 4-T2. Therefore, the adhesive may be prevented from overflowingto affect the assembly of the driving mechanism. Meanwhile, the wall4-20B is designed to ensure the lateral surface of the wall 4-20B isopposite to the lateral surface of the housing 4-10, and thereby foreignobjects may be prevented from entering the interior of the drivingmechanism. The bonding capacity between the base 4-22 and the housing4-10 is enhanced. It should be noted that the term “groove” recitedhereinafter may include the first groove 4-T1 and/or the second groove4-T2.

FIG. 4-7B is a partial cross-sectional view illustrating the base 4-22in FIG. 4-7A and the housing 4-10 after assembly. As shown in FIG. 4-7B,the second groove 4-T2 is formed on a surface, which is perpendicular tothe optical axis 4-O, of the base 4-22. In other words, the secondgroove 4-T2 is formed on the base plate 4-20A.

FIG. 4-7C is a partial cross-sectional view illustrating the base 4-22in FIG. 4-7A and the housing 4-10 after assembly in accordance withanother embodiment of the present disclosure. As shown in FIG. 4-7C, thesecond groove 4-T2 may also be formed on a surface, which is parallel tothe optical axis 4-O, of the base 4-22. That is, the second groove 4-T2is formed on the wall 4-20B. It should be noted that“sealing-all-around” can be achieved using such a design. That is, theadhesive is applied around the whole base 4-22, and the gap between thebase 4-22 and the housing 4-10 is entirely occupied by the adhesive.Therefore, foreign objects may be further prevented from entering theinterior of the driving mechanism.

Next, referring to FIG. 4-8A, FIG. 4-8A is a top view illustrating afirst elastic member 4-70″ in accordance with an embodiment of thepresent disclosure. As shown in FIG. 4-8A, the first elastic member4-70″ includes an inner frame body 4-75, an outer frame body 4-76, atleast one string portion 4-77, and at least one notch 4-78. The innerframe body 4-75 substantially corresponds to the carrier 4-30. The outerframe body 4-76 substantially corresponds to the housing 4-10 (see FIGS.4-2, 4-3A, and 4-3B). The string portion 4-77 is located between theinner frame body 4-75 and the outer frame body 4-76, and connects theinner frame body 4-75 and the outer frame body 4-76. The notch 4-78 islocated on opposite sides of the first elastic member 4-70″, and isprovided for filling an adhesive. In addition, the notch 4-78 isadjacent to the housing 4-10, and located on the side of the housing4-10. For example, the notch 4-78 may correspond to a central positionof the side of the housing 4-10. That is, the notch 4-78 may correspondto the junction between the string portion 4-77 and the outer frame body4-76. In some other embodiments, the notch 4-78 may also be disposed inanother suitable position as required.

It should be noted that, in this embodiment, the first elastic member4-70″ is described as an example. However, in some other embodiments,the aforementioned features may also be applicable to the above secondelastic member.

Referring to FIG. 4-8B, FIG. 4-8B is a top view illustrating the firstelastic member 4-70″ after filling adhesive in accordance with anembodiment of the present disclosure. In this embodiment, the adhesives4-S1, 4-S2, and 4-S3 are respectively filled into correspondingpositions of the first elastic member 4-70″. As shown in FIG. 4-8B, theadhesive 4-S1 is filled into the notch 4-78. The adhesive 4-S2 is filledinto the notches located at four corners of the outer frame body 4-76.Both the adhesives 4-S1 and 4-S2 are configured to bond the firstelastic member 4-70″ to the fixed portion 4-F (including the housing4-10 and the base 4-20). The adhesive 4-S3 is filled into the notcharound the inner frame body 4-75, and is configured to bond the firstelastic member 4-70″ to the carrier 4-30. It should be noted that thejunction between the string portion 4-77 and the outer frame body 4-76may be secured by arranging the adhesive 4-S1 so that the string portion4-77 is less possibly detached during operation. In addition, the notch4-78 is disposed as a rectangle so that the space usage efficiency inthe mechanism may be increased, and the bonding strength may also beenhanced at the same time.

Referring to FIGS. 4-9A and 4-9B, FIG. 4-9A is a schematic perspectiveview illustrating a carrier 4-30′ and a driving coil 4-40′ in accordancewith an embodiment of the present disclosure, and FIG. 4-9B is anenlarged view illustrating a region 4-N in FIG. 4-9A. It should be notedthat the driving coil 4-40′ is not illustrated in FIG. 4-9B for clearlyshowing the structural feature of the carrier 4-30′. As shown in FIG.4-9A, the driving coil 4-40′ is disposed around the carrier 4-30′ togenerate an electromagnetic force with the magnetic members 4-60 (seeFIG. 4-10A). In this embodiment, a bevel surface 4-34 is formed on oneside, which faces the driving coil 4-40′, of the carrier 4-30′, and thebevel surface 4-34 tilts relative to a plane perpendicular to theoptical axis 4-O (i.e. XY-plane). A wire (not shown) extended from thedriving coil 4-40′ is disposed on the bevel surface 4-34, and the wirewinds around a wire pillar 4-35 to be electrically connected to thecircuit board 4-80. The wire of the driving coil 4-40′ may be easilyguided by the design of the bevel surface 4-34 so that the possibilityof damaging the wire is effectively reduced.

Referring to FIG. 4-10A, FIG. 4-10A is a schematic view illustrating therelative positions between the first elastic member 4-70 a, the secondelastic member 4-72 a, the magnetic members 4-60, and the base 4-23after assembly in accordance with another embodiment of the presentdisclosure. As shown in FIG. 4-10A, four magnetic members 4-60 aredisposed over the base 4-23 relative to four sides of the base 4-23. Thesecond elastic member 4-72 a is also disposed over and connected to thebase 4-23. The first elastic member 4-70 a is disposed over the secondelastic member 4-72 a, and connected to the positioning members 4-26. Itshould be noted that, in some other embodiments, the first elasticmember 4-70 a and the second elastic member 4-72 a may also be connectedto any member of the fixed portion 4-F.

FIG. 4-10B is a side view illustrating the relative positions betweenthe first elastic member 4-70 a, the second elastic member 4-72 a, andthe magnetic members 4-60 in FIG. 4-10A after assembly. As shown in FIG.4-10B, when observed in the direction that is perpendicular to theoptical axis (such as the X direction in this embodiment), the firstelastic member 4-70 a and the driving assembly 4-EM (the magneticmembers 4-60) partially overlaps. In other words, the junctions betweenthe first elastic member 4-70 a and the positioning members 4-26 aredesigned at four corners of the mechanism, in order to make way for themagnetic members 4-60 which are respectively located on four sides ofthe mechanism. Therefore, the height of the first elastic member 4-70 ain Z-axis direction may be in the range of the magnetic members 4-60.The interior space of the mechanism may be further properly used by theabove structural design, and the height of the mechanism is reduced toachieve miniaturization.

FIG. 4-10C is a schematic view illustrating the relative positionsbetween the first elastic member 4-70 a, the second elastic member 4-72a, and the base 4-23 in FIG. 4-10A after assembly. As shown in FIG.4-10C, the first elastic member 4-70 a has a first contact 4-701, andthe first elastic member 4-70 a is connected to the positioning member4-26 through the first contact 4-701. The second elastic member 4-72 ahas at least one second contact 4-721, and the second elastic member4-72 a is connected to the base 4-23 through the second contact 4-721.When observed in the direction that is parallel to the optical axis 4-O(Z-axis direction), the first contact 4-701 and the second contact 4-721do not overlap, and thereby the interior space of the mechanism may befurther effectively utilized to achieve miniaturization.

It should be noted that, in this embodiment, the positioning member 4-26has a trench 4-V′. The difference between the trench 4-V′ in FIG. 4-10Cand the trench 4-V shown in FIG. 4-6B is that the trenches 4-V′ and 4-Vare located at different corners of the positioning member 4-26. Thatis, the trench 4-V′ is located closer to a center of one side of thebase 4-23, and corresponds to the first elastic member 4-70 a. Inaddition, the trench 4-V′ has a bottom surface that tilts relative tothe XY-plane. The trench 4-V′ may be provided for adjusting the positionof the first elastic member 4-70 a during assembly, and the accuracy ofthe positioning can be increased. The trench 4-V′ may also be providedfor filling the adhesive to enhance the bonding strength.

FIG. 4-10D is a schematic view illustrating the positioning member 4-26in accordance with another embodiment of the present disclosure. Asshown in FIG. 4-10D, the positioning member 4-26 is substantiallydisposed as a taper so that positioning is facilitated during theassembly. In addition, the possibility that the positioning member 4-26will collide with other components can be decreased, foreign objectsgenerated by the collision can be reduced, and image quality will not beaffected. Meanwhile, the difficulty of the process may also be reducedby the structural design used in this embodiment.

FIG. 5-1 is a perspective view of an electronic device 5-A1 inaccordance with some embodiments of the disclosure. The electronicdevice 5-A1 may be a portable electronic device (such as a smartphone, atablet computer, or a laptop computer) or a vehicle-type electronicdevice (such as driving recorder). In this embodiment, the electronicdevice 5-A1 is a smartphone.

The electronic device 5-A1 includes an outer housing 5-A10, a displaypanel 5-A20, and at least one camera module 5-A30. The outer housing5-A10 may be a plate structure. The display panel 5-A20 is disposed on adisplay surface 5-A11 of the outer housing 5-A10, and configured todisplay an image.

The camera module 5-A30 is disposed in the outer housing 5-A10, andcorresponds to a light hole 5-A12 of the outer housing 5-A10. The cameramodule 5-A30 generates image signals according to the incident lightfalling on the camera module 5-A30 via the light hole 5-A12. The displaypanel 5-A20 displays an image according to the image signals. In someembodiments, the camera module 5-A30 has a zoom function and opticalanti-shake function.

For clarity, there are one light hole 5-A12 and one camera module 5-A30are illustrated in the figures of the present disclosure. In someembodiments, there are light holes 5-A12 disposed on the rear surface5-A13 and/or the display surface 5-A11 of the outer housing 5-A10, andthere are light holes 5-A12 corresponding to different camera modules5-A30.

FIG. 5-2 is a perspective view of a driving mechanism 5-1 in accordancewith some embodiments of the present disclosure. FIG. 5-3 is an explodedview of the driving mechanism 5-1 in accordance with some embodiments ofthe present disclosure. The camera module 5-A30 includes a drivingmechanism 5-1 and an optical element 5-L1. The driving mechanism 5-1 isconfigured to move the optical element 5-L1 along an optical axis 5-AX1.The optical element 5-L1 may include lenses 5-L11. The optical axis5-AX1 may pass through the center of the lenses 5-L11 of the opticalelement 5-L1, and the lenses 5-L11 extend perpendicular to the opticalaxis 5-AX1 and are arranged along the optical axis 5-AX1. Moreover, theoptical axis 5-AX1 may be parallel to the movement direction 5-D1.

In this embodiment, the incident light passes through the opticalelement 5-L1 along the optical axis 5-AX1, and falls on an image sensor(not shown in figures) of the camera module 5-A30. The driving mechanism5-1 moves the optical element 5-L1 along the optical axis 5-AX1 to makethe incident light to focus on the image sensor via the lenses 5-L11.

As shown in FIGS. 5-2 and 5-3, the driving mechanism 5-1 includes aframe 5-10, a carrying base 5-20, a drive module 5-30, elastic elements5-40 and a base 5-60. The frame 5-10 may be a hollow structure. Theframe 5-10 is disposed on the base 5-60, and a receiving space 5-S1 isformed between the frame 5-10 and the base 5-60. The carrying base 5-20is disposed in the receiving space 5-S1 of the frame 5-10, andconfigured to carry the optical element 5-L1.

In this embodiment, the carrying base 5-20 has a top carrying surface5-21 and a carrying hole 5-22. The top carrying surface 5-21 may beperpendicular to the optical axis 5-AX1. The carrying hole 5-22 isformed on the top carrying surface 5-21, and extends the optical axis5-AX1. In some embodiments, the optical axis 5-AX1 passes through thecenter of the carrying hole 5-22. The optical element 5-L1 is affixed tothe carrying hole 5-22.

The drive module 5-30 is disposed between the frame 5-10 and thecarrying base 5-20, and configured to drive the carrying base 5-20 tomove relative to the frame 5-10. The drive module 5-30 includes drivewires 5-31 and magnetic elements 5-32. The drive wire 5-31 may bedisposed on the carrying base 5-20, and correspond to the magneticelement 5-32. The magnetic element 5-32 is affixed to the frame 5-10,and located in the receiving space 5-S1.

In this embodiment, there are two drive wires 5-31 disposed on twoopposite sides of the carrying base 5-20. There are two magneticelements 5-32 corresponding to the drive wires 5-31. The magneticelements 5-32 may be permanent magnets. The drive wires 5-31 generate amagnetic field by applying current to the drive wires 5-31, and thus amagnetic force is generated between the drive wires 5-31 and themagnetic elements 5-32. The carrying base 5-20 can be moved relative theframe 5-10 along the optical axis 5-AX1 by the magnetic force.

The elastic elements 5-40 may be elastic sheets disposed on the topcarrying surface 5-21 and the bottom carrying surface 5-21 a of thecarrying base 5-20. The elastic elements 5-40 are elastically connectedto the frame 5-10 and the carrying base 5-20, and configured to apply anelastic force between the frame 5-10 and the carrying base 5-20. Whenthe carrying base 5-20 is moved relative to the frame 5-10 along theoptical axis 5-AX1, the elastic element 5-40 can return the carryingbase 5-20 to an initial position.

In some embodiments, during assembling the driving mechanism 5-1, afirst glue (not shown in figures) is disposed on the edge of the upperelastic element 5-40 and the side wall of the frame 5-10. Afterwards,the base 5-60 is assembled with the frame 5-10, and a second glue (notshown in figures) is filled between the first glue and the base 5-60.Moreover, the second glue can flow into a location between the side walland the frame 5-10 and the base 5-60. Accordingly, the assemblydifficulty of driving mechanism 5-1 can be reduced.

FIG. 5-4 is a perspective view of the frame 5-10 and the carrying base5-20 in accordance with some embodiments of the present disclosure.FIGS. 5-5A to 5-5C are schematic views of the frame 5-10 and thecarrying base 5-20 in accordance with some embodiments of the presentdisclosure. As shown in FIG. 5-5A, the carrying base 5-20 is in aninitial position relative to the frame 5-10. As shown in FIG. 5-5B, thecarrying base 5-20 is in a low position relative to the frame 5-10. Asshown in FIG. 5-5C, the carrying base 5-20 is in a raised positionrelative to the frame 5-10.

The carrying base 5-20 further has a buffer groove 5-23 and a limitinggroove 5-24. The buffer groove 5-23 is formed on the top carryingsurface 5-21, and the limiting groove 5-24 is formed on the bottombuffer surface 5-231 of the buffer groove 5-23. In some embodiments, thecarrying base 5-20 may not include the buffer groove 5-23. The limitinggroove 5-24 is formed on the top carrying surface 5-21.

The frame 5-10 includes an upper surface 5-11 and a through hole 5-12.The upper surface 5-11 is perpendicular to the optical axis 5-AX1. Thethrough hole 5-12 is formed on the upper surface 5-11, and the opticalaxis 5-AX1 may pass through the center of the through hole 5-12. Thethrough hole 5-12 is connected to the receiving space 5-S1. The frame5-10 further includes position elements 5-13. The position elements 5-13are connected to the upper surface 5-11 and extend to the carrying base5-20. In other words, the position elements 5-13 extend in the movementdirection 5-D1.

In this embodiment, the position element 5-13 can pass through thebuffer groove 5-23 and extend into the limiting groove 5-24. Accordingto the design of the position element 5-13 and the limiting groove 5-24,the position element 5-13 can be used to limit the rotation angle anddisplacement of the carrying base 5-20 relative to the frame 5-10.

The position element 5-13 includes a connection portion 5-131 and aposition portion 5-132. The connection portion 5-131 is connected to theupper surface 5-11, and the position portion 5-132 is connected to theconnection portion 5-131. In this embodiment, the position portion 5-132and the connection portion 5-131 are formed in a T shape. At least oneportion of the position portion 5-132 is located in the limiting groove5-24 of the carrying base 5-20.

As shown in FIG. 5-5A, the position portion 5-132 is polygonal. In thisembodiment, the position portion 5-132 is quadrilateral, but it is notlimited thereto. In some embodiments, position portion 5-132 is arectangle, but it is not limited thereto.

The position portion 5-132 includes a top surface 5-133, a bottomsurface 5-134, two side surfaces 5-135, and round corners 5-136. The topsurface 5-133 faces the upper surface 5-11. The bottom surface 5-134 isopposite to the top surface 5-133, and adjacent to the bottom stopsurface 5-242 of the limiting groove 5-24. The side surface 5-135 isconnected to the top surface 5-133 and the bottom surface 5-134 via theround corner 5-136.

In some embodiments, the frame 5-10 is made from metal materials, andthe carrying base 5-20 is made from plastic. Therefore, with the roundcorners 5-136, the chances of scratching the carrying base 5-20 andcausing contaminating particles from the carrying base 5-20 when theposition portion 5-132 comes into contact with the carrying base 5-20are lower.

The contaminating particles may be moved between the carrying base 5-20and the frame 5-10 due to the movement of the driving mechanism 5-1, sothat the carrying base 5-20 cannot be correctly moved with respect tothe frame 5-10. Moreover, the contaminating particles may enter thecarrying base 5-20 and attach to the lens 5-L11 or the image sensor dueto the movement of the driving mechanism 5-1. Therefore, the cameraquality of the camera module 5-A30 may be decreased.

In this embodiment, the carrying base 5-20 further includes stopelements 5-25 disposed on the top carrying surface 5-21. The stopelements 5-25 are separated from the frame 5-10, and extend toward theupper surface 5-11. The stop elements 5-25 are closer to the uppersurface 5-11 than the bottom stop surface 5-242 of the limiting groove5-24. When the electronic device 5-A1 is impacted or shaken, the stopelement 5-25 may provide a buffer function to reduce the damage of thedriving mechanism 5-1.

In some embodiments, the longest width 5-W1 of the buffer groove 5-23 isgreater than the longest width 5-W2 of the limiting groove 5-24. In someembodiments, the longest width 5-W1 of the buffer groove 5-23 is equalto the longest width 5-W2 of the limiting groove 5-24. The widths 5-W1and 5-W2 are measured in a direction that is perpendicular to theoptical axis 5-AX1 (as shown in FIG. 5-4).

In this embodiment, the longest width 5-W3 of the position portion 5-132is greater than the longest width 5-W4 of the connection portion 5-131.Moreover, the longest width 5-W2 of the limiting groove 5-24 is greaterthan the longest width 5-W3 of the position portion 5-132. Therefore,the position portion 5-132 can be moved in the limiting groove 5-24, andmay not in contact with the bottom stop surface 5-242 and the side wall5-243 of the limiting groove 5-24. The widths 5-W3 and 5-W4 are measuredin a direction that is perpendicular to the optical axis 5-AX1.

As shown in FIG. 5-5A, when the carrying base 5-20 is in an initialposition relative to the frame 5-10, the position portion 5-132 islocated at the center area of the limiting groove 5-24. The side surface5-135 of the position portion 5-132 is separated from the side wall5-243 of the limiting groove 5-24. The bottom surface 5-134 of theposition portion 5-132 is separated from the bottom stop surface 5-242of the limiting groove 5-24. The top surface 5-133 of the positionportion 5-132 is separated from the opening 5-241 of the limiting groove5-24.

As shown in FIG. 5-5B, when the carrying base 5-20 is moved to a lowposition relative to the frame 5-10, the top surface 5-133 of theposition portion 5-132 is adjacent to the opening 5-241, and is far fromthe bottom stop surface 5-242. In other words, the distance between thetop surface 5-133 and the bottom stop surface 5-242 is greater than thedistance between the top surface 5-133 and the opening 5-241. Moreover,the opening 5-241 of the limiting groove 5-24 is farther from the uppersurface 5-11 than the top surface 5-133 of the position portion 5-132.

As shown in FIG. 5-5C, when the carrying base 5-20 is moved to a raisedposition relative to the frame 5-10, the bottom surface 5-134 of theposition portion 5-132 is adjacent to the bottom stop surface 5-242, andfar from the opening 5-241. In other words, the distance between thebottom surface 5-134 and the bottom stop surface 5-242 is shorter thanthe distance between the bottom surface 5-134 and the opening 5-241.Moreover, the opening 5-241 of the limiting groove 5-24 is closer to theupper surface 5-11 than the top surface 5-133 of the position portion5-132.

As shown in FIG. 5-5A to FIG. 5-5C, in an normal case the positionportion 5-132 and the connection portion 5-131 will not scratch thecarrying base 5-20 when the carrying base 5-20 is moved relative to theframe 5-10, since the longest width 5-W2 of the limiting groove 5-24 isgreater than the longest width 5-W3 of the position portion 5-132 andthe longest width 5-W4 of the connection portion 5-131.

When the electronic device 5-A1 is impacted or shaken, the positionportion 5-132 may collide with the side wall 5-243 or the bottom stopsurface 5-242 of the limiting groove 5-24 so as to block excessivedisplacement and rotation of the carrying base 5-20 relative to theframe 5-10. Accordingly, the driving mechanism 5-1 is protected.Moreover, since the longest width 5-W3 of the position portion 5-132 isgreater than the longest width 5-W4 of the connection portion 5-131, theprobability that the connection portion 5-131 scratches the carryingbase 5-20 can be reduced even when the carrying base 5-20 is slightlyinclined with respect to the frame 5-10. Accordingly, the contaminatingparticles can be reduced.

FIG. 5-6 is a perspective view of a frame 5-10 in accordance with someembodiments of the disclosure. FIG. 5-7 is a top view of the frame 5-10in accordance with some embodiments of the disclosure. As shown in FIG.5-6, the position portion 5-132 and the connection portion 5-131 areformed in an L shape. The through hole 5-12 may be a slightly rectangle.There are four position elements 5-13 located at four corners of thethrough holes 5-12. The width of the connection portion 5-131 of thepresent embodiment may be greater than the width 5-W4 of the connectionportion 5-131 of FIG. 5-5A, and thus the strength of the positionelement 5-13 may be enhanced.

As shown in FIG. 5-7, the position element 5-13 can be symmetricallyarranged at the edge of through hole 5-12 around optical axis 5-AX1. Inthis embodiment, the position element 5-13 may be symmetrically arrangedon the edge of the through hole 5-12 with a rotational axissymmetrically with the optical axis 5-AX1, so that the carrying base5-20 (shown in FIG. 5-4) operates more smoothly with respect to theframe 5-10. The position element 5-13 may be symmetrically arranged onthe edge of the through hole 5-12 about the optical axis 5-AX1 in arotationally symmetric manner, so that the carrying base 5-20 (shown inFIG. 5-4) can be moved more smoothly relative to the frame 5-10.

FIG. 5-8 is a perspective view of a frame 5-10 and a combination frame5-70 in accordance with some embodiments of the disclosure. FIG. 5-9 isa top view of the frame 5-10 and the combination frame 5-70 inaccordance with some embodiments of the disclosure. The drivingmechanism 5-1 further includes a combination frame 5-70 disposed on theupper surface 5-11 of the frame 5-10. The combination frame 5-70 mayextend along a plane that is perpendicular to the optical axis 5-AX1,and may be a ring-like structure.

The combination frame 5-70 and the frame 5-10 may be made by metalmaterials. The combination frame 5-70 includes soldering holes 5-71. Insome embodiments, the combination frame 5-70 is a rectangle, and thesoldering holes 5-71 are located at the corners of the combination frame5-70, and adjacent to the position elements 5-13. When the combinationframe 5-70 is disposed on the upper surface 5-11 of the frame 5-10,solder materials (not shown) may be disposed within the soldering holes5-71 so as to affix the combination frame 5-70 to the frame 5-10. Inaddition, an external component (not shown) can be affixed to thecombination frame 5-70 by using solder materials, so that the drivingmechanism 5-1 can be firmly combined with the external component.

In this embodiment, the frame 5-10 may further include dispensing holes5-14. The dispensing holes 5-14 are connected to the through hole 5-12,and located at two opposite sides of the position element 5-13. Thecombination frame 5-70 covers the dispensing holes 5-14. When thecombination frame 5-70 is disposed on the upper surface 5-11 of theframe 5-10, bonding glue (not shown in figures) can be filled in thedispensing holes 5-14, so as to affix the combination frame 5-70 to theframe 5-10. Moreover, the combination frame 5-70 can be affixed to theframe 5-10 more firmly by the bonding glue flowing between thecombination frame 5-70 and the upper surface 5-11, and the gap betweenthe combination frame 5-70 and the frame 5-10 can be reduced.

The shortest width 5-W5 of the combination frame 5-70 is greater thanthe shortest width 5-W6 of the upper surface 5-11. Therefore, in thisembodiment, the intensity of the frame 5-10 can be enhanced by thecombination frame 5-70. The widths 5-W5 and 5-W6 may be measured in thesame direction that may be perpendicular to the optical axis 5-AX1.

FIG. 5-10 is an exploded view of a driving mechanism 5-1 in accordancewith some embodiments of the present disclosure, wherein there are someelements omitted in FIG. 10. FIG. 5-11 is a perspective view of acarrying base 5-20 and an elastic element 5-40 in accordance with someembodiments of the present disclosure. FIG. 5-12 is a side view of thecarrying base 5-20 and the elastic element 5-40 in accordance with someembodiments of the present disclosure.

The elastic element 5-40 may extend along a plane that is perpendicularto the optical axis 5-AX1. The elastic element 5-40 has a first fixedportion 5-41, deformation portions 5-42, and a second fixed portion5-43. The first fixed portion 5-41 may be affixed to the top carryingsurface 5-21 of the carrying base 5-20. The first fixed portion 5-41 maybe a ring-like structure surrounding the optical axis 5-AX1.

The deformation portions 5-42 are connected to the first fixed portion5-41 and the second fixed portion 5-43, and located between the firstfixed portion 5-41 and the second fixed portion 5-43. The deformationportions 5-42 may be curved line structures, and may be in a suspendedstate. In other words, the deformation portions 5-42 may be separatedfrom elements other than the elastic element 5-40 (such as the carryingbase 5-20, the frame 5-10, and the drive module 5-30). In thisembodiment, the elastic element 5-40 may be a slightly rectangle, but itis not limited thereto. The deformation portions 5-42 are located in thecorners of the elastic element 5-40.

The second fixed portion 5-43 may be affixed to the frame 5-10. Thesecond fixed portion 5-43 may be a ring-like structure surrounding theoptical axis 5-AX1. The deformation portion 5-42 may apply an elasticforce to the first fixed portion 5-41 and the second fixed portion 5-43.In other words, since the first fixed portion 5-41 is affixed to thecarrying base 5-20, and the second fixed portion 5-43 is affixed to theframe 5-10, the reformation portion 5-42 may apply an elastic force tothe carrying base 5-20 and the frame 5-10.

In some embodiments, the elastic portion of the elastic element 5-40 maybe bent so that the first fixed portion 5-41 and the second fixedportion 5-43 are not on the same plane. In this way, the elastic element5-40 can generate a pre-pressure on the carrying base 5-20 when thecarrying base 5-20 is in an initial position, so as to bring thecarrying base 5-20 closer to the base 5-60. Therefore, the drivingmechanism 5-1 may be more stable when it does not move the carrying base5-20.

As shown in FIGS. 5-10 to 5-12, the deformation portion 5-42 of theelastic element 5-40 corresponds to the buffer groove 5-23. Thedeformation portion 5-42 and the buffer groove 5-23 may be arranged inan extension direction that is parallel to the optical axis 5-AX1. Inthis embodiment, the extension direction of the optical axis 5-AX1 maybe the movement direction 5-D1. Therefore, in this embodiment, when thecarrying base 5-20 is moved relative to the frame 5-10 in the movementdirection 5-D1, the deformation portion 5-42 is deformed. However, sincethe reformation portion 5-42 corresponds to the buffer groove 5-23, thereformation portion 5-42 does not collide with the carrying base 5-20,and thus the carrying base 5-20 can be accurately moved relative to theframe 5-10.

As shown in FIG. 5-10, the drive wire 5-31 of the drive module 5-30surrounds the side wall of the carrying base 5-20. The drive wire 5-31is located at the corner of the carrying base 5-20, and adjacent to thelimiting groove 5-24. The deformation portion 5-42 of the elasticelement 5-40 directly faces the drive wire 5-31. The deformation portion5-42 and the drive wire 5-31 are arranged in the movement direction5-D1, and separated from each other.

FIG. 5-13 is a top view of a frame 5-10, a carrying base 5-20 and adrive module 5-30 in accordance with embodiments of the presentdisclosure, wherein the upper surface 5-11 of the frame 5-10 are omittedin FIG. 5-13. As shown FIGS. 10 to 13, the frame 5-10 has a slightlyquadrangular shape, and has four side walls 5-15 and four corners 5-16connected to the side walls 5-15. The drive wire 5-31 is a slightlyoctagonal, and has first segments 5-311 and second segments 5-312. Thefirst segments 5-311 are parallel to the side walls 5-15. The secondsegments 5-312 are connected to two adjacent first segments 5-311, andcorrespond to the corners 5-16.

The carrying base 5-20 further includes wire holders 5-26 holding thefirst segments 5-311, and the wire holders 5-26 are separated from thesecond segments 5-312. Moreover, there are four magnetic elements 5-32disposed on four side walls 5-15 of the frame 5-10. The magneticelements 5-32 correspond to the wire holders 5-26 and the first segments5-311 of the drive wire 5-31. In some embodiments, each of the magneticelements 5-32 is parallel to one of corresponding the first segments5-311 and wire holders 5-26.

The separated wire holders 5-26 allow the corner spaces 5-S2 to beformed between the corners 5-16 of the frame 5-10 and the carrying base5-20. The deformation portions 5-42 of the elastic element 5-40 can belocated in the corner spaces 5-S2. Therefore, collision of thedeformation portion 5-42 with the carrying base 5-20 and the frame 5-10can be avoided, and the carrying base 5-20 can be moved more accuratelyrelative to the frame 5-10.

In this embodiment, one end of the magnetic element 5-32 extends intothe corner space 5-S2. The magnetic element 5-32 can be symmetricallyarranged in the frame 5-10 about the optical axis 5-AX1 in arotationally symmetric manner. Moreover, the carrying base 5-20 furtherincludes winding portions 5-27 in the corner spaces 5-S2. The windingends 5-313 of the drive wires 5-31 are disposed on the winding portions5-27. Therefore, the design of the carrying base 5-20 better utilizesthe space within the frame 5-10.

FIG. 5-14 is a side view of the carrying base 5-20 and the elasticelement 5-40 in accordance with some embodiments of the presentdisclosure. As shown in FIG. 5-12, the bottom buffer surface 5-231 ofthe buffer groove 5-23 may be perpendicular to the extension directionof the optical axis 5-AX1. As shown in FIG. 5-14, at least one portionof the bottom buffer surface 5-231 of the buffer groove 5-23 is inclinedrelative to the extension direction of the optical axis 5-AX1. In thisembodiment, the bottom buffer surface 5-231 is inclined relative to thebottom stop surface 5-242. Therefore, the volume of the buffer groove5-23 can be increased by the inclined bottom buffer surface 5-231,thereby preventing collisions between the deformation portion 5-42 andthe carrying base 5-20.

FIG. 5-15 is an exploded view of the frame 5-10 and the carrying base5-20 in accordance with some embodiments of the present disclosure. FIG.5-16 is a cross-sectional view of the frame 5-10 and the carrying base5-20 in accordance with some embodiments of the present disclosure. Thebase 5-60 includes a base body 5-61 and a first dustproof ring 5-62. Thebase body 5-61 may be a ring-like structure. The base body 5-61 has athrough hole 5-611 corresponding to the carrying hole 5-22. The opticalaxis 5-AX1 may pass through the center of the through hole 5-611. Thefirst dustproof ring 5-62 is disposed on the base body 5-61, andsurrounds to the through hole 5-611 and the optical axis 5-AX1.

The carrying base 5-20 includes a second dustproof ring 5-28 and bottomstop portions 5-29. The second dustproof ring 5-28 is disposed on thebottom carrying surface 5-21 a of the carrying base 5-20, and surroundsthe carrying hole 5-22 and the optical axis 5-AX1. The bottom stopportion 5-29 is disposed on the bottom carrying surface 5-21 a, andarranged around the second dustproof ring 5-28. In this embodiment, thebottom stop portion 5-29 is separated from the second dustproof ring5-28, and the bottom stop portion 5-29 is farther from the optical axis5-AX1 than the second dustproof ring 5-28.

In this embodiment, the first dustproof ring 5-62 surrounds the seconddustproof ring 5-28 and is separated from the second dustproof ring5-28. Therefore, the surrounding contaminating particles are difficultto enter the carrying hole 5-22 and the through hole 5-611 via the gap5-G1 between the first dustproof ring 5-62 and the second dustproof ring5-28.

As shown in FIG. 5-16, the bottom stop portion 5-29 corresponds to theblocking portion 5-621 of the first dustproof ring 5-62, and separatedfrom the blocking portion 5-621. Moreover, the height of the bottom stopportion 5-29 relative to the bottom carrying surface 5-21 a is less thanthe height of the second dustproof ring 5-28 relative to the bottomground receiving surface 5-21 a. Therefore, when the electronic device5-A1 is impacted or shaken, the stop element 5-25 may provide a bufferfunction to reduce the damage of the driving mechanism 5-1.

FIG. 5-17 is an exploded view of a frame 5-10 and a carrying base 5-20in accordance with some embodiments of the present disclosure. FIG. 5-18is a cross-sectional view of the frame 5-10 and the carrying base 5-20in accordance with some embodiments of the present disclosure. FIG. 5-19is a schematic view of the frame 5-10 and the carrying base 5-20 inaccordance with some embodiments of the present disclosure. In thisembodiment, the second dustproof ring 5-28 surrounds the first dustproofring 5-62.

The base 5-60 further includes first protrusion portions 5-612 and firstdepression grooves 5-613. In this embodiment, the base 5-60 is aslightly rectangular shape. The base 5-60 has four first protrusionportions 5-612, and four first depression grooves 5-613. However, thenumber of the first protrusion portions 5-612 and the first depressiongrooves 5-613 are not limited thereto.

The first protrusion portions 5-612 and the first depression grooves5-613 are alternately arranged along the outer side of the firstdustproof ring 5-62. The first protrusion portions 5-612 are adjacent tothe edges 5-614 of the base 5-60, and the first depression grooves 5-613are located at the corners 5-615 of the base 5-60. Each of the corners5-615 is connected to two adjacent edges. Since the first protrusionportions 5-612 are disposed on the edges 5-614 having shorter width, andthe first depression grooves 5-613 are disposed on the corners 5-615having longer width, the first protrusion portions 5-612 and the firstdepression grooves 5-613 do not excessively weaken the intensity of thebase 5-60.

The second dustproof ring 5-28 has second depression grooves 5-281 andsecond protrusion portions 5-282. The second depression grooves 5-281and the second protrusion portions 5-282 are alternately arranged in aloop path. The second depression grooves 5-281 correspond to the firstprotrusion portions 5-612, and second protrusion portions 5-282correspond to the first depression grooves 5-613.

In this embodiment, when the carrying base 5-20 is in a low position,the first protrusion portion 5-612 is separated from the seconddepression groove 5-281, and the second protrusion portion 5-282 isseparated from the first depression groove 5-613. When the carrying base5-20 is in an initial position or a raised position, the firstprotrusion portion 5-612 is located in the second depression groove5-281, and the second protrusion portion 5-282 is located in the firstdepression groove 5-613.

When the carrying base 5-20 is moved to a low position, the firstprotrusion portion 5-612 is located in the second depression groove5-281, and the second protrusion portion 5-282 is located in the firstdepression groove 5-613. In this way, excessive rotation of the carryingbase 5-20 relative to the base 5-60 can be prevented, and thus thedriving mechanism 5-1 can be protected. In addition, with the design ofthe disclosed base 5-60 and the second dustproof ring 5-28, the movingrange of the carrying base 5-20 relative to the frame 5-10 can beincreased.

In some embodiments, the depth of the first depression groove 5-613 isgreater than the depth of the second depression groove 5-281. Thedistance 5-d 1 between the second protrusion portion 5-282 and the firstdepression groove 5-613 is greater than the distance 5-d 2 between thefirst curve portion 5-612 and the second depression groove 5-281.Moreover, when the carrying base 5-20 is in a raised position, the firstprotrusion portion 5-612 may contact or abut at the bottom of the seconddepression groove 5-281. The second dished portion 5-282 is locatedwithin the first depression groove 5-613 and is separable from thebottom of the first depression groove 5-613. Therefore, when theelectronic device 5-A1 is impacted or shaken, the second protrusionportion 5-282 may provide a buffer function to reduce the damage of thedriving mechanism 5-1.

FIG. 6-1 is a perspective view of an electronic device 6-A1 inaccordance with some embodiments of the disclosure. The electronicdevice 6-A1 may be a portable electronic device (such as a smartphone, atablet computer, or a laptop computer) or a vehicle-type electronicdevice (such as driving recorder). In this embodiment, the electronicdevice 6-A1 is a smartphone.

The electronic device 6-A1 includes an outer housing 6-A10, a displaypanel 6-A20, and at least one camera module 6-A30. The outer housing6-A10 may be a plate structure. The display panel 6-A20 is disposed on adisplay surface 6-A11 of the outer housing 6-A10, and configured todisplay an image.

The camera module 6-A30 is disposed in the outer housing 6-A10, andcorresponds to a light hole 6-A12 of the outer housing 6-A10. The cameramodule 6-A30 generates image signals according to the incident lightfalling on the camera module 6-A30 via the light hole 6-A12. The displaypanel 6-A20 displays an image according to the image signals. In someembodiments, the camera module 6-A30 has a zoom function and opticalanti-shake function.

For clarity, there are one light hole 6-A12 and one camera module 6-A30are illustrated in the figures of the present disclosure. In someembodiments, there are light holes 6-A12 disposed on the rear surface6-A13 and/or the display surface 6-A11 of the outer housing 6-A10, andthere are light holes 6-A12 corresponding to different camera modules6-A30.

FIG. 6-2 is a perspective view of a driving mechanism 6-1 in accordancewith some embodiments of the present disclosure. FIG. 6-3 is an explodedview of the driving mechanism 6-1 in accordance with some embodiments ofthe present disclosure. The camera module 6-A30 includes a drivingmechanism 6-1 and an optical element 6-L1. The driving mechanism 6-1 isconfigured to move the optical element 6-L1 along an optical axis 6-AX1.The optical element 6-L1 may include lenses 6-L11. The optical axis6-AX1 may pass through the center of the lenses 6-L11 of the opticalelement 6-L1, and the lenses 6-L11 extend perpendicular to the opticalaxis 6-AX1 and are arranged along the optical axis 6-AX1. Moreover, theoptical axis 6-AX1 may be parallel to a first direction 6-D1.

In this embodiment, the incident light passes through the opticalelement 6-L1 along the optical axis 6-AX1, and falls on an image sensor(not shown in figures) of the camera module 6-A30. The driving mechanism6-1 moves the optical element 6-L1 along the optical axis 6-AX1 to makethe incident light to focus on the image sensor via the lenses 6-L11.

As shown in FIGS. 6-2 and 6-3, the driving mechanism 6-1 includes aframe 6-10, a carrying base 6-20, drive modules 6-30, a top elasticelement 6-40, bottom elastic elements 6-50, and a base 6-60. The frame6-10 may be a hollow structure. The frame 6-10 is disposed on the base6-60, and a receiving space 6-S1 is formed between the frame 6-10 andthe base 6-60. The carrying base 6-20 is disposed in the receiving space6-S1 of the frame 6-10, and configured to carry the optical element6-L1.

In this embodiment, the carrying base 6-20 includes a carrying body6-21, configured to carry an optical element 6-L1. The carrying body6-21 includes a top surface 6-211, a bottom surface 6-212 and a carryinghole 6-213. The top surface 6-211 may be perpendicular to the opticalaxis 6-AX1. The carrying hole 6-213 is connected to the top surface6-211 and the bottom surface 6-212, and the carrying hole 6-213 extendsthe optical axis 6-AX1. In some embodiments, the optical axis 6-AX1passes through the center of the carrying hole 6-213. Moreover, theoptical element 6-L1 is affixed to the carrying hole 6-213.

The drive module 6-30 is disposed in the frame 6-10, and located betweenthe frame 6-10 and the carrying body 6-210. The drive module 6-30 isconfigured to move the carrying base 6-20 relative to the frame 6-10 inthe first direction 6-D1.

The drive module 6-30 includes drive wires 6-31 and magnetic elements6-32. The drive wires 6-31 are disposed on the carrying base 6-20, andcorrespond to the magnetic elements 6-32. The magnetic elements 6-32 areaffixed to the inner side of the frame 6-10, and located in thereceiving space 6-S1.

In this embodiment, there are two drive wires 6-31 disposed on twoopposite sides of the carrying base 6-20. There are two magneticelements 6-32 corresponding to the drive wires 6-31. The magneticelements 6-32 may be permanent magnets. The drive wires 6-31 generate amagnetic field by applying current to the drive wires 6-31, and thus amagnetic force is generated between the drive wires 6-31 and themagnetic elements 6-32. The carrying base 6-20 can be moved relative theframe 6-10 along the optical axis 6-AX1 by the magnetic force.

The top elastic element 6-40 and the bottom elastic element 6-50 may beelastic sheets, disposed on the top surface 6-211 and the bottom surface6-212 of the carrying body 6-21. The top elastic element 6-40 and thebottom elastic element 6-50 are elastically connected to the frame 6-10and the carrying base 6-20, and configured to apply an elastic forcebetween the frame 6-10 and the carrying base 6-20. When the carryingbase 6-20 is moved relative to the frame 6-10 along the optical axis6-AX1, the top elastic element 6-40 and the bottom elastic element 6-50can return the carrying base 6-20 to an initial position.

FIG. 6-4 is a perspective view of the frame 6-10 and the carrying base6-20 in accordance with some embodiments of the present disclosure,wherein the perspective of FIG. 6-4 is different from the perspective ofFIG. 6-3. FIGS. 6-5A to 6-5C are schematic views of the frame 6-10 andthe carrying base 6-20 in accordance with some embodiments of thepresent disclosure. As shown in FIG. 6-5A, the carrying base 6-20 is inan initial position relative to the frame 6-10. As shown in FIG. 6-5B,the carrying base 6-20 is in a low position relative to the frame 6-10.As shown in FIG. 6-5C, the carrying base 6-20 is in a raised positionrelative to the frame 6-10.

The frame 6-10 includes a top portion 6-11, a side wall 6-12, andposition elements 13. The top portion 6-11 may be a plate structure, andextends perpendicular to the optical axis 6-AX1. The top elastic element6-40 may be disposed on the carrying body 6-21, and adjacent to the topportion 6-11. The top portion 6-11 has a through hole 6-111 connected tothe receiving space 6-S1. Moreover, the optical axis 6-AX1 passesthrough the center of the through hole 6-111. The side wall 6-12 may bea ring-like structure, connected to the edge of the top portion 6-11.The side wall 6-12 may extend along the first direction 6-D1, andsurround the optical axis 6-AX1.

The position element 6-13 may be connected to the top portion 6-11, andextend toward the carrying body 6-21. In this embodiment, the positionelement 6-13 may extend in the first direction 6-D1. The positionelement 6-13 may include a narrow portion 6-131 and a position portion6-132. The narrow portion 6-131 is connected to the edge of the throughhole 6-111, and the position portion 6-132 is connected to the narrowportion 6-131. In this embodiment, the position portion 6-132 and thenarrow portion 6-131 are formed in a T shape or an L shape. In thisembodiment, the position portion 6-132 and the narrow portion 6-131 areformed in a T shape.

The carrying base 6-20 further includes first stop portions 6-22 andsecond stop portions 6-23. The first stop portions 6-22 are disposed onthe top surface 6-211 of the carrying body 6-21, and configured to limitthe range of motion of the carrying body 6-21 in the first direction.The first stop portions 6-22 are located between the carrying base 6-20and the top portion 6-11 of the frame 6-10. In this embodiment, thefirst stop portions 6-22 are separated from the frame 6-10, and extendtoward the top portion 6-11 in the first direction 6-D1.

The second stop portion 6-23 is disposed on the carrying body 6-21, andconfigured to limit the range of motion of the carrying body 6-21 in thefirst direction. The second stop portion 6-23 is formed in the carryingbody 6-21. In this embodiment, the second stop portion 6-23 is formed onthe top surface 6-211 of the carrying body 6-21, and extends in thefirst direction 6-D1. The first stop portion 6-22 is closer to the topportion 6-11 of the frame 6-10 than the second stop portion 6-23.

The second stop portion 6-23 includes a buffer groove 6-231 and alimiting groove 6-232. The buffer groove 6-231 is formed on the topsurface 6-211, and the limiting groove 6-232 is formed on the bottom ofthe buffer groove 6-231. In some embodiments, the second stop portion6-23 may not include the buffer groove 6-231, and the limiting groove6-232 is formed on the top surface 6-211. As shown in FIGS. 6-5A to6-5C, the position element 6-13 passes through the buffer groove 6-231and extends into the limiting groove 6-232.

In some embodiments, the longest width 6-W1 of the buffer groove 6-231is greater than or equal to the longest width 6-W2 of the limitinggroove 6-232. The longest width 6-W2 of the limiting groove 6-232 isgreater than the longest width 6-W3 of the position portion 6-132. Thelongest width 6-W3 of the position portion 6-132 is greater than thelongest width 6-W4 of the narrow portion 6-131. Therefore, the secondstop portion 6-23 may be moved in the limiting groove 6-232, and may notin contact with the limiting groove 6-232. The widths 6-W1, 6-W2, 6-W3and 6-W4 are measured in direction that is perpendicular to the opticalaxis 6-AX1.

As shown in FIG. 6-5A, when the carrying base 6-20 is located at aninitial position relative to the frame 6-10, the position portion 6-132is located at the center of the limiting groove 6-232, and the firststop portion 6-22 is separated from the top portion 6-11 of the frame6-10. The distance 6-d 1 between the top elastic element 6-40 and thetop portion 6-11 of the frame 6-10 is greater than the distance 6-d 2between the first stop portion 6-22 and the top portion 6-11 of theframe 6-10. Therefore, the first stop portion 6-22 may prevent theelastic member from colliding with the frame 6-10, and thus the carryingbase 6-20 can be accurately moved relative to the frame 6-10.

In this embodiment, the distance 6-d 3 between the second stop portion6-23 and the top portion 6-11 of the frame 6-10 is greater than thedistance 6-d 1 between the top elastic element 6-40 and the top portion6-11 of the frame 6-10. The top elastic element 6-40 may be locatedwithin the buffer groove 6-231 of the second stop portion 6-23 duringdeformation. Therefore, the second stop portion 6-23 may prevent the topelastic element 6-40 from colliding with the carrying body 6-21, andthus the carrying base 6-20 can be accurately moved relative to theframe 6-10.

As shown FIG. 6-5B, when the carrying base 6-20 is moved to a lowposition relative to the frame 6-10 in the first direction 6-D1, theposition portion 6-132 is moved toward the opening 233 of the limitinggroove 6-232, and the first stop portion 6-22 is far from the topportion 6-11 of the frame 6-10. In this embodiment, the distance 6-d 4of the first stop portion 6-22 and the top portion 6-11 of the frame6-10 in FIG. 6-5B is greater than the distance 6-d 2 between the firststop portion 6-22 and the top portion 6-11 of the frame 6-10 in FIG.6-5A.

As shown in FIG. 6-5C, when the carrying base 6-20 is moved to a raisedposition relative to the frame 6-10 in the first direction 6-D1, theposition portion 6-132 is moved toward the bottom of the limiting groove6-232, and the first stop portion 6-22 is close to the top portion 6-11of the frame 6-10. In this embodiment, the distance 6-d 5 between thefirst stop portion 6-22 and the top portion 6-11 of the frame 6-10 inFIG. 6-5C is shorter than the distance 6-d 2 between the first stopportion 6-22 and the top portion 6-11 of the frame 6-10 in FIG. 6-5A.

As shown in FIGS. 6-5A to 6-5C, the first stop portion 6-22 is separatedfrom the top portion 6-11 of the frame 6-10, and the size of thelimiting groove 6-232 is greater than the size of the second stopportion 6-23. In a normal case, when the carrying base 6-20 movesrelative to the frame 6-10, the first stop portion 6-22 will not collidewith the frame 6-10, and the position element 6-13 will not collide withthe second stop portion 6-23.

However, in some cases, when the electronic device 6-A1 is impacted orshaken, the first stop portion 6-22 may collide with frame 6-10 in thefirst direction 6-D1 so as to block excessive displacement of thecarrying base 6-20 relative to the frame 6-10 in the first direction6-D1. Therefore, the first stop portion 6-22 can limit the range ofmotion of the carrying body 6-21 in the first direction 6-D1. Moreover,the first stop portion 6-22 can disperse the collision force of thecarrying base 6-20 with respect to the frame 6-10 so as to protect thedriving mechanism 6-1.

In some cases, when the electronic device 6-A1 is impacted or shaken,the second stop portion 6-23 can block the position element 6-13 in thefirst direction 6-D1 and the lateral direction 6-D2 so as to blockexcessive displacement and rotation of the carrying base 6-20 relativeto the frame 6-10. Therefore, the second stop portion 6-23 can limit therange of motion of the carrying body 6-21 in the first direction 6-D1and the lateral direction 6-D2. Moreover, the second stop portion 6-23can disperse the collision force of the carrying base 6-20 with respectto the frame 6-10 so as to protect the driving mechanism 6-1. In thisembodiment, the lateral direction 6-D2 may be any directions that areperpendicular to the first direction 6-D1.

Accordingly, with the design of the first stop portion 6-22 and thesecond stop portion 6-23, the rotation angle and displacement of thecarrying base 6-20 relative to the frame 6-10 can be limited.

FIG. 6-6A is a perspective view of a frame 6-10 and a drive wire 6-31 inaccordance with some embodiments of the present disclosure, wherein theperspective of FIG. 6-6A is different from the perspective of FIGS. 6-3and 6-4. FIG. 6-7 is a top view of the frame 6-10, the carrying base6-20 and the drive module 6-30 in accordance with some embodiments ofthe present disclosure, wherein the top portion 6-11 of the frame 6-10is omitted.

The carrying base 6-20 further includes two wire holders 6-24 and twowinding elements 6-25. The wire holders 6-24 are disposed the sidesurface (third side surface) 214 of the carrying body 6-21. In otherwords, the wire holders 6-24 are located at two opposite sides of thecarrying body 6-21. The winding elements 6-25 are disposed on the sidesurface 6-215 and the side surface 6-216 of the carrying body 6-21. Theside surface 6-215 is opposite the side surface 6-216, and issubstantially perpendicular to the side surface 6-214.

The drive wire 6-31 is disposed on the wire holder 6-24, and the windingend 6-311 of the drive wire 6-31 can be wound on the winding element6-25. The magnetic element 6-32 is disposed on the side wall 6-12 of theframe 6-10, and corresponds to the drive wire 6-31. As shown in FIG.6-7, the wire holder 6-24 is closer to the magnetic element 6-32 thanthe drive wire 6-31. Therefore, the wire holder 6-24 can limit the rangeof motion of the carrying body 6-21 in a third direction 6-D4. The thirddirection 6-D4 may be a lateral direction, and may be perpendicular tothe optical axis 6-AX1.

In this embodiment, when the electronic device 6-A1 is impacted orshaken, the wire holder 6-24 may collide with the frame 6-10 in thethird direction 6-D4 so as to block excessive displacement of thecarrying base 6-20 relative to the frame 6-10. Moreover, the wire holder6-24 can disperse the collision force of the carrying base 6-20 withrespect to the frame 6-10 so as to protect the driving mechanism 6-1.

In this embodiment, the wire holder 6-24 includes support portions 6-241and glue grooves 6-242. The support portion 6-241 is closer to themagnetic element 6-32 than the drive wire 6-31. Therefore, the supportportions 6-241 can disperse the collision force of the carrying base6-20 with respect to the frame 6-10. The glue groove 6-242 is locatedbetween two adjacent support portions 6-241. After the drive wire 6-31is assembled on the wire holder 6-24, the glue 6-M1 can be filled in theglue groove 6-242 and in contact with the drive wire 6-31 and the wireholder 6-24 so as to enhance the strength of the carrying base 6-20.

FIG. 6-6B is a perspective view of the frame 6-10 in accordance withsome embodiments of the present disclosure. In this embodiment, the wireholder 6-24 includes reinforcing portions 6-243 disposed in the gluegrooves 6-242. The reinforcing portion 6-243 may be a trapezoidal, andhas an upper surface 6-2431 and two inclined surfaces 6-2432. The uppersurface 6-2431 is located in the glue groove 6-242. The inclinedsurfaces 6-2432 are connected to the upper surface 6-2431, and aresymmetrically arranged. The reinforcing portion 6-243 may graduallynarrow from the bottom of the glue groove 6-242 to the upper surface6-2431.

Accordingly, the structure of the carrying base 6-20 can be strengthenedby the reinforcing portion 6-243. Moreover, by the reinforcement portion6-243, the contact area of the glue 6-M1 (as shown in FIG. 6-6A) and thewire holder 6-24 can be increased, and thus the drive wire 6-31 can befirmly affixed to the wire holder 6-24.

The carrying base 6-20 further includes a side-stop portion 6-26disposed on the side surface (first side surface) 6-215 of the carryingbody 6-21, and is configured to limit the range of motion of thecarrying body 6-21 in a second direction 6-D3. The second direction 6-D3may be a lateral direction, and may be perpendicular to the optical axis6-AX1. In this embodiment, when the electronic device 6-A1 is impactedor shaken, the side-stop portion 6-26 may collide with frame 6-10 in thesecond direction 6-D3 so as to block excessive displacement and rotationof the carrying base 6-20 relative to the frame 6-10 in the seconddirection 6-D3. Moreover, the side-stop portion 6-26 can disperse thecollision force of the carrying base 6-20 with respect to the frame 6-10so as to protect the driving mechanism 6-1.

In this embodiment, the side-stop portion 6-26 is closer to the sidewall of the frame 6-10 than the winding element 6-25. Therefore, theside-stop portion 6-26 can prevent the winding element 6-25 disposed onthe side surface 6-215 from colliding with the frame 6-10. Moreover, thewinding element 6-25 disposed on the side surface 6-216 can also serveas a stop portion, and is configured to limit the range of motion of thecarrying body 6-21 in the second direction 6-D3.

In this embodiment, the side-stop portion 6-26 includes a receivinggroove 6-261. At least one portion of the drive module 6-30 is disposedin the receiving groove 6-261. In this embodiment, a wire 6-312 of thedrive module 6-30 is located in the receiving groove 6-261, and thus theutilization of receiving space 6-S1 can be increased. Moreover, when theelectronic device 6-A1 is impacted or shaken, the side-stop portion 6-26can protect the wire 6-312. In some embodiments, the drive wire 6-31includes the wire 6-312, and the wire 6-312 is connected to the windingend 6-311.

The driving mechanism 6-1 further includes a position sensing module6-70 (as shown in FIG. 6-7) disposed on the side surface (second sidesurface) 6-216 of the carrying body 6-21. In this embodiment, theposition sensing module 6-70 includes the circuit board 6-71 and theposition sensor 6-72. The position sensor 6-72 may be disposed on thecircuit board 6-71, and configured to detect the position of thecarrying base 6-20 relative to the frame 6-10.

In this embodiment, the side-stop portion 6-26 and the position sensingmodule 6-70 are disposed on two opposite sides of the carrying body6-21. Moreover, the drive module 6-30 is disposed on the side surface6-214 of the carrying body 6-21. Miniaturization of the drivingmechanism 6-1 is improved by the arrangement of the drive module 6-30,the side-stop portion 6-26 and the position sensing module 6-70.

As shown in FIG. 6-7, the side-stop portion 6-26 is adjacent to thecentral area 6-121 of the side wall 6-12 of the frame 6-1. Since thethickness of the side wall of the carrying body 6-21 corresponding tothe central area 6-121 is thinner, the side-stop portion 6-26 canstrengthen the structure of the carrying body 6-21. Moreover, the firststop portions 6-22 and 6-22 a can be far from the central area 6-121 ofthe side wall 6-12 of the frame 6-10, and thus the thickness of thecarrying body 6-21 corresponding to the side wall 6-12 in the centralarea 6-121 can be reduced. The central area 6-121 may be defined as thearea of the side wall 6-12 of the frame 6-10 closest to the carryinghole 6-213 of the carrying body 6-21.

FIG. 6-8 is a perspective view of the carrying base 6-20 and the bottomelastic element 6-50 in accordance with some embodiments of the presentdisclosure. FIG. 6-9 is a bottom view of the carrying base 6-20 and thebottom elastic element 6-50 in accordance with some embodiments of thepresent disclosure. The bottom elastic element 6-50 is disposed on thebottom surface 6-212 of the carrying body 6-21. In this embodiment,there are two bottom elastic elements 6-50 arranged surrounding thecarrying hole 6-213.

The bottom elastic element 6-50 extends a plane that is perpendicular tothe optical axis 6-AX1. The bottom elastic element 6-50 includes a firstfixed portion 6-51, a first deformation portion (deformation portion)6-52, a second fixed portion 6-53, a connection portion 6-54, a thirdfixed portion 6-55, a second deformation portion 6-56 and a fourth fixedportion 6-57. The first fixed portion 6-51 is affixed to the frame 6-10(as shown in FIGS. 6-2 and 6-3).

The first deformation portion 6-52 is connected to the first fixedportion 6-51 and the second fixed portion 6-53, and the second fixedportion 6-53 is affixed to the carrying body 6-21. The first deformationportion 6-52 may be a curved line structure. The first deformationportion 6-52 may be in a suspended state, and separated from thecarrying body 6-21 and the frame 6-10. The first deformation portion6-52 is configured to apply an elastic force to the first fixed portion6-51 and the second fixed portion 6-53. In other words, since the firstfixed portion 6-51 is affixed to the frame 6-10, and the second fixedportion 6-53 is affixed to the carrying body 6-21, the first deformationportion 6-52 may apply an elastic force to the frame 6-10 and thecarrying base 6-20.

The connection portion 6-54 is connected to the second fixed portion6-53 and the third fixed portion 6-55, and the third fixed portion 6-55is affixed to the carrying body 6-21. The connection portion 6-54 may bea curved line structure and may correspond to the shape of the carryinghole 6-213. The connection portion 6-54 is in contact with the carryingbody 6-21 and extends along the edge of the carrying hole 6-213.

The second deformation portion 6-56 is connected to the third fixedportion 6-55 and the fourth fixed portion 6-57, and the fourth fixedportion 6-57 is affixed to the frame 6-10. The second deformationportion 6-56 is adjacent to the connection portion 6-54, and separatedfrom the connection portion 6-54. The second deformation portion 6-56 isfarther from the optical axis 6-AX1 than the connection portion 6-54.The second deformation portion 6-56 may be a curved line structure. Thesecond deformation portion 6-56 may be a suspended state, and separatedfrom the carrying body 6-21 and the frame 6-10.

In this embodiment, the second deformation portion 6-56 is configured toapply an elastic force to the third fixed portion 6-55 and the fourthfixed portion 6-57. In other words, since the fourth fixed portion 6-57is affixed to the frame 6-10, and the third fixed portion 6-55 isaffixed to the carrying body 6-21, the second deformation portion 6-56may apply an elastic force to the frame 6-10 and the carrying base 6-20.

With the design of the bottom elastic element 6-50, the mechanicalstrength and stability of the driving mechanism 6-1 can be enhanced.Moreover, the design of the top elastic element 6-40 may be modifiedbased on the design of the bottom elastic element 6-50.

The carrying base 6-20 further includes third stop portions 6-27 andfourth stop portions 6-28. The third stop portions 6-27 and the fourthstop portions 6-28 are disposed on the bottom surface 6-212 of thecarrying body 6-21. The third stop portion 6-27 and the fourth stopportion 6-28 may be opposite the first stop portion 6-22 and the secondstop portion 6-23 relative to the carrying body 6-21. The third stopportion 6-27 and the fourth stop portion 6-28 may be arranged along theedge of the carrying hole 6-213. The third stop portion 6-27 and thefourth stop portion 6-28 may have a curved structure.

Third stop portion 6-27 and the fourth stop portion 6-28 are configuredto limit the range of motion of the carrying body 6-21 in the firstdirection. In this embodiment, the third stop portion 6-27 and thefourth stop portion 6-28 collide with the base 6-60 in the firstdirection 6-D1 (as shown in FIGS. 6-2 and 6-3) so as to block excessivedisplacement of the carrying base 6-20 relative to the frame 6-10 in thefirst direction 6-D1. Moreover, the third stop portion 6-27 and thefourth stop portion 6-28 disperse the collision force of the carryingbase 6-20 with respect to the frame 6-10 so as to protect the drivingmechanism 6-1.

As shown in FIG. 6-9, the width 6-W5 of the third stop portion 6-27 isshorter than the width 6-W6 of the fourth stop portion 6-28. The widths6-W5 and 6-W6 are measured on a plane that is perpendicular to theoptical axis 6-AX1. The third stop portion 6-27 is adjacent to theconnection portion 6-54 and the second deformation portion 6-56, and thethird stop portion 6-27 is closer to the optical axis 6-AX1 than theconnection portion 6-54 and the second deformation portion 6-56. Thefourth stop portion 6-28 is adjacent to the first deformation portion6-52, and the fourth stop portion 6-28 is closer to the optical axis6-AX1 than the first deformation portion 6-52. With the third stopportion 6-27 and the fourth stop portion 6-28, the strength of thecarrying base 6-20 can be enhanced.

As shown in FIG. 6-9, the carrying body 6-21 further includes anidentification portion 6-217 disposed on one of the side surface of thecarrying body 6-21. In this embodiment, the identification portion 6-217may be a groove. With the identification portion 6-217, the carryingbase 6-20 can be formed into an asymmetrical structure, and thus theorientation of the carrying base 6-20 may be identified when the drivingmechanism 6-1 is assembled.

As shown in FIG. 6-9, the carrying body 6-21 further includesrestriction portions 6-218 and overflow grooves 6-219. In thisembodiment, the restriction portion 6-218 and the overflow groove 6-219are disposed on the bottom surface 6-212 of the carrying body 6-21. Eachof the overflow grooves 6-219 is adjacent to a restriction portion6-218. The overflow groove 6-219 is closer to the optical axis 6-AX1than the restriction portion 6-218. The second fixed portion 6-53 andthe third fixed portion 6-55 of the bottom elastic element 6-50 isaffixed to the restriction portion 6-218.

Accordingly, when the bottom elastic element 6-50 is affixed to thecarrying body 6-21, glue 6-M1 may be disposed in the restriction portion6-218 and in contact with the second fixed portion 6-53 and the thirdfixed portion 6-55. If too much glue 6-M1 is set, the glue 6-M1 flowingtoward the carrying hole 6-213 may flow into the overflow groove 6-219.Therefore, the overflow groove 6-219 can prevent the glue 6-M1 fromflowing into the carrying hole 6-213, thereby causing an abnormality ofthe driving mechanism 6-1.

FIG. 6-10 is a perspective view of the carrying base 6-20, the bottomelastic element 6-50, and the base 6-60 in accordance with someembodiments of the present disclosure. FIG. 6-11 is a cross-sectionalview of the frame 6-10, the carrying base 6-20, and the base 6-60 inaccordance with some embodiments of the present disclosure. FIG. 6-12 isa cross-sectional view of the carrying base 6-20 and the bottom elasticelement 6-50 in accordance with some embodiments of the presentdisclosure.

In this embodiment, the carrying base 6-20 further includes bottom stopportions 6-29 disposed on the side surface 6-214 and the bottom surface6-212 of the carrying body 6-21, and separated from the frame 6-10 andthe base 6-60. As shown in FIG. 6-12, the bottom stop portion 6-29 isdistributed on the side surface 6-214 of the carrying body 6-21, but itis not limited to the side surface 6-214. The bottom elastic element6-50 is disposed between the bottom stop portions 6-29, and thus thebottom elastic element 6-50 can be protected.

The bottom stop portion 6-29 is configured to limit the range of motionof the carrying body 6-21 in the first direction 6-D1 and the lateraldirection 6-D2. In this embodiment, the lateral direction 6-D2 isdefined as any directions that are perpendicular to the first direction6-D1.

In this embodiment, when the electronic device 6-A1 is impacted orshaken, the bottom stop portion 6-29 may collide with the base 6-60 inthe first direction 6-D1 so as to block excessive displacement of thecarrying base 6-20 relative to the base 6-60 in the first direction6-D1. Moreover, the bottom stop portion 6-29 may collide with the frame6-10 in the lateral direction 6-D2 so as to block excessive displacementof the carrying base 6-20 relative to the frame 6-10 in the lateraldirection 6-D2. In addition, the bottom stop portion 6-29 can dispersethe collision force of the carrying base 6-20 with respect to the frame6-10 or the base 6-60 so as to protect the driving mechanism 6-1.

In this embodiment, the base 6-60 includes a base body 6-61 and blockingwalls 6-62. The base body 6-61 may be a ring-like structure, andcorresponds to the carrying base 6-20. The blocking walls 6-62 aredisposed on two opposite edges of the base body 6-61, and locatedbetween the frame 6-10 and the carrying body 6-21. The blocking walls6-62 extend linearly in the same direction and are parallel to eachother. Moreover, each of the tops of the blocking walls 6-62 has agroove 6-63, extending along the extension direction of the blockingwalls 6-62.

When the frame 6-10 is assembled on the base 6-60, the blocking walls6-62 may be adjacent to or in contact with the frame 6-10, and thegrooves 6-63 may be adjacent or connected to the frame 6-10. Therefore,when the glue 6-M1 is disposed on the frame 6-10, the excess glue 6-M1may flow into the grooves 6-63 to prevent the glue 6-M1 from flowing toelements such as the bottom elastic element 6-50 or the carrying base6-20.

FIG. 6-13 is a perspective view of the carrying base 6-20 in accordancewith some embodiments of the present disclosure. In this embodiment,hollows 6-B1 are formed on the side surface 6-214 of the carrying base6-20. The side-stop portions 6-26 are formed on the side surface 6-214.Each of the side-stop portions 6-26 is adjacent to two adjacent hollows6-B1. Moreover, the side-stop portions 6-26 and the hollows 6-B1 areadjacent to the bottom surface 6-212 of the carrying body 6-21. With thesetting of the hollows 6-B1, the collision of the carrying base 6-20 onthe edge of the carrying base 6-20 with other elements (for example, thebase 6-60) can be prevented.

Referring to FIG. 7-1, in an embodiment of the disclosure, a drivingmechanism 7-10 may be disposed in an electronic device 7-20. Forexample, the electronic device 7-20 may be a digital camera or asmartphone that is able to take photographs or record video. When takingphotographs or recording video, an external light can pass through thedriving mechanism 7-10 and form an image on an image sensor (not shown)in the electronic device 7-20.

Referring to FIGS. 7-2 and 7-3, the driving mechanism 7-10 primarilycomprises a fixed portion 7-100, a first elastic member 7-200, a secondelastic member 7-300, a movable portion 7-400, and a driving module7-500. The fixed portion 7-100 has a base 7-110 and a frame 7-120,wherein the base 7-110 and the frame 7-120 can be assembled to form ahollow box. The first elastic member 7-200, the second elastic member7-300, the movable portion 7-400, and the driving module 7-500 aresurrounded by the frame 7-120 and accommodated in the box.

The base 7-110 and the frame 7-120 respectively has optical holes 7-O1and 7-O2 corresponding to each other, and the optical holes 7-O1 and7-O2 are respectively adjacent to a light-emitting side 7-11 and alight-entering side 7-12 of the driving mechanism 7-10. The externallight can pass the movable portion 7-400 through the optical holes 7-O1and 7-O2 and reach the image sensor in the electronic device 7-20.Furthermore, a plurality of wires may be formed on the base 7-110, so asto electrically connect the first elastic member 7-200, the secondelastic member 7-300, and/or the driving module 7-500.

The aforementioned wires may be formed on the base 7-110 by using themolded interconnect device (MID), for example, by laser directstructuring (LDS), microscopic integrated processing technology(MIPTEC), laser induced metallization (LIM), laser restructuring print(LRP), an aerosol jet process, or a two-shot molding method. In someembodiments, the base 7-110 may be constituted by a flat plate and aflexible printed circuit board (FPC).

The first elastic member 7-200 and the second elastic member 7-300 areconnected to the fixed portion 7-100 and the movable portion 7-400, andthe movable portion 7-400 may be hung in the box by the first elasticmember 7-200 and the second elastic member 7-300. Referring to FIG. 7-4,the first elastic member 7-200 has at least one first engaging portion7-210, at least one second engaging portion 7-220, and a plurality ofstring portions 7-230. The first engaging portion 7-210 is affixed tothe movable portion 7-400 and forms an inner diameter 7-D1 of the firstelastic member 7-200. The second engaging portion 7-220 is affixed tothe fixed portion 7-100 and forms an outer diameter 7-D2 of the firstelastic member 7-200. The string portions 7-230 connect the firstengaging portion 7-210 to the second engaging portion 7-220.

As shown in FIG. 7-5, the second elastic member 7-300 has at least onefirst connecting portion 7-310, at least one second connecting portion7-320, and a plurality of string portions 7-330. The first connectingportion 7-310 is affixed to the movable portion 7-400 and forms an innerdiameter 7-D3 of the second elastic member 7-300. The second connectingportion 7-320 is affixed to the fixed portion 7-100 and forms an outerdiameter 7-D4 of the second elastic member 7-300. The string portions7-330 connect the first connecting portion 7-310 to the secondconnecting portion 7-320.

It should be noted that the inner diameter 7-D1 of the first elasticmember 7-200 is less than the inner diameter 7-D3 of the second elasticmember 7-300, and the outer diameter 7-D2 of the first elastic member7-200 is substantially the same as the outer diameter 7-D4 of the secondelastic member 7-300.

Referring to FIGS. 7-6A to 7-6C, the movable portion 7-400 includes acarrier 7-410 and at least one optical lens 7-420. The carrier 7-410 hasan accommodating space 7-412 surrounded by its side wall 7-411. Theoptical lens 7-420 may be in contact with the side wall 7-411 in theaccommodating space 7-412, so as to be affixed to the carrier 7-410. Inthis embodiment, the cross-section area of the accommodating space 7-412adjacent to the light-emitting side 7-11 is less than that adjacent tothe light-entering side 7-12. In other words, the accommodating space7-412 has a step-shaped structure or a tapered structure.

In this embodiment, a protruding portion 7-413 is formed on the sidewall 7-411 of the carrier 7-410. The protruding portion 7-413 protrudesaway from the optical axis 7-T of the optical lens 7-420, and has afirst surface 7-413 a facing the light-entering side 7-12 (i.e. thelight-entering direction of the optical axis 7-T). Furthermore, theprotruding portion 7-413 further comprises a recess 7-414. The recess7-414 has a second surface 7-414 a facing the light-emitting side 7-11(i.e. the light-emitting direction of the optical axis 7-T), and aprotrusion 7-415 extending toward the recess 7-414 is formed on thesecond surface 7-414 a.

FIG. 7-6D is an enlarged diagram of a 7-S region in FIG. 7-6B. As shownin FIG. 7-6D, a slot 7-416 and two pillars 7-417 disposed on a side ofthe slot 7-416 may be formed on the protruding portion 7-413.

Referring to FIG. 7-3, the driving module 7-500 may comprise at leastone first electromagnetic driving assembly 7-510 disposed on the carrier7-410 of the movable portion 7-400 and at least one secondelectromagnetic driving assembly 7-520 disposed on the fixed portion7-100 for driving the movable portion 7-400 to move relative to thefixed portion 7-100 along the optical axis 7-T of the optical lens7-420. For example, the first electromagnetic driving assembly 7-520 maybe a driving coil surrounding the carrier 7-410, and the secondelectromagnetic driving assembly 7-520 may be a magnet. When currentflows through the driving coil (the first electromagnetic drivingassembly 7-510), electromagnetic effect is generated between the drivingcoil and the magnet. Thus, the carrier 7-410 and the optical lens 7-420disposed thereon may be driven to move upwardly or downwardly relativeto the fixed portion 7-100 and the image sensor along the optical axis7-T of the optical lens 7-420, and the purpose of focus adjustment canbe achieved.

In this embodiment, the driving module 7-500 comprises four secondelectromagnetic driving assemblies 7-520, respectively disposed on thefour corners of the driving mechanism 7-10. In some embodiments, thefirst electromagnetic driving assembly 7-510 may be a magnet, and thesecond electromagnetic driving assembly 7-520 may be a driving coil.

FIG. 7-7A is a cross-sectional view along line 7A-7A in FIG. 7-2, andFIG. 7-7B is a cross-sectional view along line 7B-7B in FIG. 7-2. Asshown in FIGS. 7-7A and 7-7B, when the aforementioned members of thedriving mechanism 7-10 are assembled, the first electromagnetic drivingassembly 7-510 is in contact with the side wall 7-411 of the carrier7-410. Therefore, the driving module 7-500 can directly drive thecarrier 7-410 with the optical lens 7-420, and the precision of themovement of the optical lens 7-420 can be increased.

The first electromagnetic driving assembly 7-510 is in contact with thefirst surface 7-413 a of the protruding portion 7-413, and an adhesivemember 7-P may be filled into the recess 7-414 of the carrier 7-410, soas to attach the first electromagnetic driving assembly 7-510 onto thecarrier 7-410. It should be noted that the adhesive member 7-P disposedin the recess 7-414 is in contact with the second surface 7-414 a. Sincethe first surface 7-413 a and the second surface 7-414 a face oppositedirections, and are respectively in contact with the firstelectromagnetic driving assembly 7-510 and the adhesive member 7-P, thefixing force for affixing the first electromagnetic driving assembly7-510 can be increased. Moreover, since the protrusion 7-415 extendingtoward the recess 7-414 is formed on the second surface 7-414 a, theadhesive area is increased, and the fixing force for affixing the firstelectromagnetic driving assembly 7-510 is therefore increased.

Referring to FIGS. 7-7A and 7-7B, in this embodiment, a portion of theframe 7-120 of the fixed portion 7-100 is extended into a depressionportion 7-R between the first electromagnetic driving assembly 7-510 andthe carrier 7-410, so as to prevent rotation of the carrier 7-410 whenthe driving mechanism 7-10 is collided. Furthermore, the secondelectromagnetic driving assembly 7-520 is in contact with the firstelastic member 7-200, and is separated from the second elastic member7-300.

As shown in FIGS. 7-7A to 7-7C, as observed from the optical axis 7-T ofthe optical lens 7-420, at least a portion of the first elastic member7-200 overlaps the side wall 7-411 of the carrier 7-410. Because theinner diameter 7-D1 of the first elastic member 7-200 is less than theinner diameter 7-D3 of the second elastic member 7-300, and the outerdiameter 7-D2 of the first elastic member 7-200 is substantially thesame as the outer diameter 7-D4 of the second elastic member 7-300, whenthe driving mechanism 7-10 is assembled, the first engaging portion7-210 does not overlap the first connecting portion 7-310, and thesecond engaging portion 7-220 overlaps the second connecting portion7-320.

Referring to FIG. 7-7D, when the driving mechanism 7-10 is assembled, alead 7-511 at the end of the first electromagnetic driving assembly7-510 may be accommodated in the slot 7-416 of the carrier 7-410, andmay be connected to the first connecting portion 7-310 of the secondelastic member 7-300 with solder 7-L. A portion of the first connectingportion 7-310 may be disposed between two pillars 7-417 for positioningthe second elastic member 7-300. Furthermore, a gap 7-G thatcommunicates with the slot 7-416 is formed between two pillars 7-417,and the aforementioned lead 7-511 may be exposed from the gap 7-G. Thus,the state of the welding procedure can be observed from the gap 7-G whenthe lead 7-511 is being welded to the second elastic member 7-300 withsolder 7-L.

In some embodiments, the slot 7-416 and the pillars 7-417 can be formedin a position adjacent to the first elastic member 7-200, and the lead7-511 at the end of the first electromagnetic driving assembly 7-510 maybe connected to the first elastic member 7-200 using the aforementionedmethod (i.e. the first engaging portion 7-210 can be disposed betweenthe pillars 7-417, and the lead 7-511 may be connected to the firstengaging portion 7-210 with solder 7-L).

Referring to FIG. 8-1, in an embodiment of the disclosure, a drivingmechanism 8-10 can be disposed in an electronic device 8-20 and used tohold and drive an optical member 8-30, so that the optical member 8-30can move relative to an image sensor (not shown) in the electronicdevice 8-20, and the purpose of focus adjustment can be achieved. Forexample, the electronic device 8-20 can be a digital camera or asmartphone having the function of capturing photographs or making videorecordings, and the optical member 8-30 can be a lens.

FIG. 8-2 is a schematic diagram of the driving mechanism 8-10 accordingto an embodiment of the disclosure, and FIG. 8-3 is an exploded-viewdiagram of the aforementioned driving mechanism 8-10. As shown in FIGS.8-2 and 8-3, the driving mechanism 8-10 primarily comprises a fixedportion 8-100, two elastic members 8-8-200 and 8-300, a movable portion8-400, a driving module 8-500, a circuit board 8-600, and a positiondetecting module 8-700. The fixed portion 8-100 comprises a base 8-110and a frame 8-120. The driving module 8-500 comprises at least one firstelectromagnetic driving assembly 8-510 and at least one secondelectromagnetic driving assembly 8-520. The position detecting module8-700 comprises a sensor 8-710 and a sensing object 8-720. The specificstructures of the aforementioned members are discussed below.

Referring to FIGS. 8-3 and 8-4A, the base 8-110 of the fixed portion8-100 has a plate 8-111, a plurality of protrusions 8-112, a pluralityof pillars 8-113, and a plurality of supporting parts 8-114. The plate8-111 has a surface 8-111 a facing the movable portion 8-400. Theprotrusions 8-112 and the pillars 8-113 protrude from this surface 8-111a.

First sidewalls 8-115 parallel to the optical axis of the optical member8-30 are formed around the base 8-110, and the corners of the base 8-110are formed by the connecting portions between the adjacent firstsidewalls 8-115. The pillars 8-113 a are situated at the corners, andthe protrusions 8-112 are adjacent to the corners. It should be notedthat, in this embodiment, two protrusions 8-112 can be disposed on oneof the first sidewalls 8-115, and adjacent to the different corners. Inother words, the distance between each of the protrusion 8-112 and thecenter of the first sidewall 8-115 is greater than the distance betweeneach of the protrusion 8-112 and the corner of the base 8-110.

The supporting part 8-114 is connected to the plate 8-111, and protrudesalong the direction away from the first sidewall 8-115. The height ofthe supporting part 8-114 is less than that of the plate 8-111, and thebottom of the supporting part 8-114 is aligned with the bottom of theplate 8-111.

In this embodiment, the base 8-110 can further comprises at least onerecess 8-116, at least one partition 8-117, and at least one toothedstructure 8-118. The recess 8-116 is formed on the first sidewall 8-115and disposed on the protrusion 8-112. As shown in FIG. 8-4B, the recess8-116 has a step-shaped structure, wherein the cross-section area of theportion of the step-shaped structure adjacent to the bottom surface8-111 b of the base 8-110 is greater than that of the portion of thestep-shaped structure away from the bottom surface 8-111 b. Theaforementioned cross-section means the cross-section parallel to theXY-plane. In some embodiments, the recess 8-116 can comprises atrapezoidal structure or a triangular structure.

The partition 8-117 is disposed on the protrusion 8-112, adjacent to therecess 8-116 and slightly extended along the direction away from thefirst sidewall 8-115 (the extending length of the partition 8-117 ismuch less than that of the supporting part 8-114, for example, theextending length of the partition 8-117 is 1/10 of the extending lengthof the supporting part 8-114). The toothed structure 8-118 can be formedbetween two protrusions 8-112.

Referring to FIG. 8-4C, in this embodiment, at least one metal wire8-130 can be embedded in the base 8-110. The metal wire 8-130 can have aplurality of pins 8-131 adjacent to the different first sidewalls 8-115,so as to connect the elastic members 8-200 and 8-300, the driving module8-500, the circuit board 8-600, and/or the image sensor. It should benoted that, as shown in FIG. 8-4C, the pins 8-131 a connected to thecircuit board 8-600 and the pins 8-131 b connected to the elastic member8-300 are respectively disposed on opposite sides of the base 8-110, soas to prevent a short circuit. In some embodiments, the pins connectedto the image sensor and the pins 8-131 b connected to the elastic member8-300 can also be disposed on opposite sides of the base 8-110, so as toprevent the detachment of the solder on the pins 8-131 b connected tothe elastic member 8-300 due to the heat produced when the pins arebeing welding to the image sensor. Furthermore, in this embodiment, somepins 8-131 are inserted into the pillars 8-113 of the base 8-110, andtherefore the metal wire 8-130 can be tightly embedded in the base8-110.

The metal wire 8-130 can be formed on the base 8-110 by using the moldedinterconnect device (MID), for example, by laser direct structuring(LDS), microscopic integrated processing technology (MIPTEC), laserinduced metallization (LIM), laser restructuring print (LRP), an aerosoljet process, or a two-shot molding method.

Referring to FIGS. 8-3 and 8-5, the frame 8-120 comprises a plurality ofsecond sidewalls 8-121 parallel to the optical axis of the opticalmember 8-30. At least one opening 8-122 is formed on the second sidewall8-121. Furthermore, an engaging portion 8-123 is formed below theopening 8-122.

The base 8-110 and the frame 8-120 can be assembled and form a hollowbox. As shown in FIG. 8-6, when the base 8-110 and the frame 8-120 areassembled, the recess 8-116 on the first sidewall 8-115 of the base8-110 corresponds to the opening 8-122 on the second sidewall 8-121 ofthe frame 8-116, and the engaging portion 8-123 is extended to thebottom surface 8-111 b. The partition 8-117 is disposed between thefirst sidewall 8-115 and the second sidewall 8-121, so as to facilitatethe assembly of the base 8-110 and the frame 8-120.

An adhesive member 8-P can be filled in the recess 8-116 and the opening8-122. The adhesive member 8-P accommodated in the recess 8-116 and theopening 8-122 is extended along the first sidewall 8-115 through thecapillary action, and then filled between the first sidewall 8-115 andthe second sidewall 8-121. In detail, the adhesive member 8-P isextended to the position beside the partition 8-117 and the positionbetween the surface 8-111 a of the plate 8-111 and the supporting part8-114. Thus, the gap between the base 8-110 and the frame 8-120 can befilled with the adhesive member 8-P, so as to prevent the intrusion ofthe external object and increase the adhesive area therebetween.

Furthermore, since the adhesive member 8-P contacts the supporting part8-114 and the step-shaped structure of the recess 8-116, the adhesivemember 8-P can be engaged with the base even if an external forceapplies on the frame 8-120 in any direction. The adhesive strengthbetween the base 8-110 and the frame 8-120 can be improved.

Referring to FIG. 8-3, the elastic members 8-200 and 8-300 arerespectively disposed on opposite sides of the movable portion 8-400,and connect to the movable portion 8-400 and the fixed portion 8-100.The movable portion 8-400 can be hung in the hollow box. For example,the movable portion 8-400 can be a lens holder, and the optical member8-300 can be affixed to the movable portion 8-400.

The first electromagnetic driving assembly 8-510 and the secondelectromagnetic driving assembly 8-520 can be respectively disposed onthe movable portion 8-400 and the fixed portion 8-100, so as to drivethe movable portion 8-400 to move relative to the fixed portion 8-100along the optical axis of the optical member 8-30. In particular, thefirst electromagnetic driving assembly 8-510 can be a driving coil, andthe second electromagnetic driving assembly 8-520 can be a magnet. Whena current flows through the driving coil (the first electromagneticdriving assembly 8-510), the electromagnetic effect is generated betweenthe driving coil and the magnet. Thus, the movable portion 8-400 and theoptical member 8-30 disposed thereon can be driven to move upwardly ordownwardly relative to the fixed portion 8-100 and the image sensoralong the optical axis of the optical member 8-30, and the purpose offocus adjustment can be achieved.

In this embodiment, the second magnetic driving assembly 8-520 can beaffixed to the toothed structure 8-118 of the base 8-110 using glue, soas to increase the adhesive area. The second magnetic driving assemblycan be stably affixed to the base 8-110.

The circuit board 8-600 can be disposed on the frame 8-120 of the fixedportion 8-100, and electrically connected to the metal wire 8-130 in thebase 8-110. As shown in FIG. 8-7, when the adhesive member 8-P is notfilled, the user can connect the circuit board 8-600 to the metal wire8-130 with solder 8-L outside the optical driving mechanism 8-10. Whenthe adhesive member 8-P is filled, the solder 8-L can be covered by theadhesive member 8-P, so as to achieve an integrated appearance andprevent short circuits (as shown in FIG. 8-2). In some embodiments, theelastic members 8-200 and 8-300 and metal wire 8-130 can be alsoconnected using solder 8-L, and covered by the adhesive member 8-P.

The sensor 8-710 of the position detecting module 8-700 is disposed onthe circuit board 8-600, and the sensing object 8-720 is disposed on themovable portion 8-400. The sensor 8-710 can determine the position ofthe fixed portion 8-100 in the Z-axis by detecting the movement of thesensing object 8-720. For example, the sensor 8-710 can be a Hallsensor, a magnetoresistance effect sensor (MR sensor), a giantmagnetoresistance effect sensor (GMR sensor), a tunnelingmagnetoresistance effect sensor (TMR sensor), or a fluxgate sensor, andthe sensing object 8-720 can be a magnet.

Referring to FIG. 8-8A, in another embodiment, the protrusions 8-112 onthe same side of the base 8-110 of the fixed portion 8-100 can havedifferent heights, and the appearances of the recesses 8-116 thereon canbe adjusted accordingly. As shown in FIG. 8-8B, when the drivingmechanism 8-10 comprises this base 8-110, glue 8-G can be applied to theprotrusion 8-112 with low height to attach the second magnetic drivingassembly 8-520, and the miniaturized driving mechanism 8-10 can beobtained.

As shown in FIG. 8-9, in another embodiment, the second electromagneticassembly 8-520 is affixed to the frame 8-120 of the fixed portion 8-100.When the current does not flow through the first electromagneticassembly 8-510 (driving coil), the first electromagnetic assembly 8-510contacts and attaches the base 8-110. In other words, the distancebetween the second electromagnetic assembly 8-520 (magnetic member) andthe bottom surface 8-111 b of the base 8-110 is greater than thedistance between the first electromagnetic assembly 8-510 and the bottomsurface 8-111 b. Therefore, the user can ensures that the movableportion 8-400 is not inclined relative to the fixed portion 8-100, andother members (such as the elastic member 8-300) can use the space belowthe second electromagnetic driving assembly 8-520.

As shown in FIGS. 8-10A and 8-10B, in another embodiment, the protrusion8-112 of the base 8-110 has a first end 8-112 a and a second end 8-112b, wherein the first end 8-112 a is farther from the first sidewall8-115 than the second end 8-112 b, and the width 8-D1 of the first end8-112 a is less than the width 8-D2 of the second end 8-112 b.Therefore, the space in the hollow box can be released for use by othermembers.

Referring to FIG. 8-11, in another embodiment, a depression portion 8-Rcan be formed on the bottom surface 8-111 b of the base 8-110. Theappearance of the depression portion 8-R corresponds to the appearanceof the image sensor. That is, the depression portion 8-R can have thewide section and the narrow section. The narrow section is used toprovide space for disposing the pins 8-131 c connected to the imagesensor. Furthermore, a process can be applied on the bottom surface8-111 b of the base 8-110 to increase its roughness, so as to facilitatethe connection of the other external member (such as the aforementionedimage sensor).

Referring to FIG. 8-12, in another embodiment, the movable portion 8-400has a winding pole 8-410, and a lead on the end of the firstelectromagnetic driving assembly 8-510 can wrap around the winding pole8-410. For avoiding the collision between the winding pole 8-410 and thesecond electromagnetic driving assembly 8-520 during the movable portionmoves, the second electromagnetic driving assembly 8-520 can disposed ina deviation manner. As shown in FIG. 8-12, the upper and lower secondelectromagnetic driving assemblies 8-520 in the figure deviate along thedirection away from the winding poles 8-410. The center of the movableportion 8-400 is disposed between the winding pole 8-410 and the centerof the second electromagnetic driving assembly 8-520 (as observed fromthe direction perpendicular to the longitudinal axis of the secondelectromagnetic driving assembly 8-520). The left and right secondelectromagnetic driving assemblies 8-520 respectively move downwardlyand upwardly according to the deviation directions of the upper andlower second electromagnetic driving assemblies 8-520. The drivingmodule 8-500 can therefore provide uniform driving force on the movableportion 8-400.

Referring to FIG. 8-13A, in another embodiment, the pin 8-131 of themetal wire 8-130 embedded in the base 8-110 is exposed from the recess8-116 for positioning the metal wire 8-130 (the adhesive member 8-P hasnot been filled in the figure, and the pin 8-131 can be covered by theadhesive member 8-P after filling). For preventing the short circuitbetween the frame 8-120 and the pin 8-131 when assembling, the opening8-122 of the frame 8-120 is extended to its bottom.

Furthermore, as shown in FIG. 8-12B, in this embodiment, as observedfrom the optical axis of the optical member 8-30, each of the metalwires 8-130 and the elastic member 8-300 overlap at two positions, andthe aforementioned positions are located at the different corners of thebase 8-110. Therefore, the miniaturized driving mechanism 8-10 can beobtained, and increased structural strength can be achieved.

FIG. 9-1 is an exploded view of a lens module in accordance with anembodiment of the disclosure. It should be noted that the lens modulemay be provided in handheld digital products such as mobile phones ortablet PCs. The lens module 9-10 primarily comprises a driving mechanismand an optical element 9-E received therein. In this embodiment, thedriving mechanism may constitute a voice coil motors (VCM), and theoptical element 9-E may comprise an optical lens to achieve auto-focus(AF) function.

As shown in FIG. 9-1, the driving mechanism comprises a housing 9-H, aframe 9-F, an upper spring 9-S1, at least a lower spring 9-S2, a base9-B, a holder 9-R, a circuit board 9-P, at least a longitudinal magnet9-M, and at least a coil 9-C corresponding to the magnet 9-M. The holder9-R is connected to the frame 9-F and the base 9-B through the upper andlower springs 9-S1 and 9-S2 (resilient elements), so that the holder 9-Ris suspended in the housing 9-H. The optical element 9-E is affixed inthe holder 9-R, and the magnet 9-M and the coil 9-C can constitute adrive assembly for driving the holder 9-R and the optical element 9-E tomove along an optical axis 9-O of the optical element 9-E, so as toachieve auto-focus (AF) of the lens module.

In this embodiment, the frame 9-F has a quadrilateral structure, whereintwo columns 9-F1 and a stop surface 9-F2 are formed on a side of theframe 9-F, corresponding to an opening of the upper spring 9-S1. Arecess 9-F10 is formed between the two columns 9-F1 for receiving theelectronic component on the circuit board 9-P. The stop surface 9-F2 cancontact and restrict the holder 9-R in a limit position, so as toprotect the electronic component from being impacted and damaged by theholder 9-R. Additionally, since the lower spring 9-S2 has a deformableportion longer than the upper spring 9-S1, the hardness of the lowerspring 9-S2 may be greater than that of the upper spring 9-S1 tosufficiently support the holder 9-R and the optical element 9-E, andexcessive deformation and mechanical failure of the lower spring 9-S2can be also prevented.

FIG. 9-2 is a schematic view of the lens module in FIG. 9-1 afterassembly, wherein the optical element 9-E is removed therefrom. FIG. 9-3is a cross-sectional view taken along the line 9A1-9A1 in FIG. 9-2, andFIG. 9-4 is a cross-sectional view taken along the line 9A2-9A2 in FIG.9-2. FIG. 9-5 is a schematic view of the driving mechanism in FIG. 9-2with the housing 9-H removed therefrom. Referring to FIGS. 9-1 to 9-5,two multipolar magnets 9-M and two coils 9-C are disposed in the drivingmechanism. Each of the magnets 9-M comprises two magnetic units 9-M1 and9-M2 having opposite polar directions, as shown in FIGS. 9-1 and 9-3.The two coils 9-C have an oval-shaped structure and are affixed toopposite sides of the holder 9-R, corresponding to the magnets 9-M. Whena current is applied to the coil 9-C, an electromagnetic force can begenerated between the coil 9-C and the magnet 9-M for driving the holder9-R and the optical element 9-E to move relative to the housing 9-Halong the optical axis 9-O.

Still referring to FIGS. 9-1 to 9-5, the housing 9-H is affixed to thebase 9-B, wherein the frame 9-F, the upper spring 9-S1, the lower spring9-S2, the holder 9-R, the circuit board 9-P, the magnets 9-M, and thecoils 9-C are received in a space between the housing 9-H and the base9-B. In this embodiment, the frame 9-F and the circuit board 9-P areaffixed to an inner surface of the housing 9-H. The magnets 9-M and anouter portion of the upper spring 9-S1 are affixed to a lower surface ofthe frame 9-F, and the upper and lower springs 9-S1 and 9-S2respectively connect the holder 9-R with the frame 9-F and the base 9-B.It should be noted that the housing 9-H may comprise metal material andform two extending portions 9-H1 (FIG. 9-2) respectively extending totwo recesses 9-R1 of the holder 9-R (FIG. 9-5), so that theelectromagnetic force generated between the magnet 9-M and the coil 9-Ccan be enhanced, and the holder 9-R can rotate relative to the housing9-H within a specific range to prevent mechanical failure due toexcessive rotation of the holder 9-R.

FIG. 9-6A is a schematic view showing relative position of the frame9-F, the circuit board 9-P, and three electronic elements 9-G1 to 9-G3after assembly of the driving mechanism. Referring to FIGS. 9-5 and9-6A, the frame 9-F has a quadrilateral structure and forms at least avertical surface 9-F3 that connects two adjacent sides of thequadrilateral structure. Specifically, the vertical surface 9-F3 isadjacent to the housing 9-H but not in contact with the housing 9-H. Inthis embodiment, the vertical surface 9-F3 is parallel to the opticalaxis 9-O (Z axis) and angled with respect to the two adjacent sides ofthe quadrilateral structure. For example, the vertical surface 9-F3 maybe angled with respect to the X and Y axes at 45 degrees.

Additionally, at least one side of the frame 9-F forms a longitudinalsloping surface 9-F32 (depressed surface) adjacent to the housing 9-Hbut not in contact with the housing 9-H. The sloping surface 9-F32 isparallel to the X axis or the Y axis, and it is angled with respect tothe Z axis (e.g. 45 degrees). Thus, a groove can be formed between theinner surface of the housing 9-H and the vertical surface 9-F31/slopingsurface 9-F32 for guiding the glue to flow, thus efficiently preventingoverflow of the glue and enhancing adhesion strength between the housing9-H and the frame 9-F.

In another embodiment as shown in FIG. 9-6B, the L-shaped depressedsurface 9-F32′ can substitute for the sloping surface 9-F32 in FIGS. 9-3to 9-6A, wherein the depressed surface 9-F32′ is adjacent to the housing9-H but not in contact with the housing 9-H. Thus, a groove can beformed between the inner surface of the housing 9-H and the depressedsurface 9-F32′, thereby preventing overflow of the glue and enhancingadhesion strength between the housing 9-H and the frame 9-F.

Referring to FIG. 9-6A, the electronic element 9-G1 (such as anintegrated circuit element) on the inner surface of the circuit board9-P is accommodated in the recess 9-F10 between the two columns 9-F1 ofthe frame 9-F, and the electronic element 9-G2 (such as a displacementsensing element) and the electronic element 9-G3 (such as a filterelement) are disposed outside the recess 9-F10. It should be noted thatthe columns 9-F1 can be used to position and protect the electronicelement 9-G1, and the stop surface 9-F2 can contact the holder toprevent the electronic element 9-G1 from being impacted and damaged bythe holder 9-R.

FIG. 9-7 is a schematic view showing relative position of the magnets9-M, the coils 9-C, the holder 9-R, the circuit board 9-P, and theelectronic elements 9-G1 to 9-G3 after assembly of the drivingmechanism. As shown in FIGS. 9-1, 9-5, and 9-7, two magnetic elements9-D1 and 9-D2 (such as magnets) are affixed to opposite sides of theholder 9-R and located close to two corners of the holder 9-R. Thus,weight balance of the driving mechanism can be improved, and themagnetic attractive forces generated between the housing 9-H and themagnetic elements 9-D1 and 9-D2 can also be balanced to preventunexpected tilt of the lens module. Specifically, the two recesses 9-R1for receiving the extending portions 9-H1 of the housing 9-H in FIG. 9-2are located close to the other two corners of the holder 9-R, differentfrom the corners where the two magnetic elements 9-D1 and 9-D2 arelocated (FIG. 9-7).

It should be noted that the electronic element 9-G2 (displacementsensing element) is located near the magnetic element 9-D1, anddisplacement of the holder 9-R and the optical element 9-E relative tothe housing 9-H along the Z axis can be detected by the electronicelement 9-G2, so as to achieve auto-focus (AF) of the lens module. Insome embodiments, the electronic element 9-G2 may be a Hall effectsensor, MR sensor, or Fluxgate sensor.

FIG. 9-8 is a partial cross-sectional view showing a holder 9-R and anoptical element 9-E in accordance with another embodiment of thedisclosure. As shown in FIG. 9-8, the optical element 9-E has a curvedouter surface 9-E1, and the holder 9-R forms at least a rib 9-R2 and anannular bottom portion 9-R3 below the rib 9-R2. The rib 9-R2 protrudesfrom an inner surface of the holder 9-R toward the curved outer surface9-E1, and the bottom portion 9-R3 is closer to the optical element 9-Ethan the rib 9-R2. During assembly, the glue can be disposed in a space9-RL between the optical element 9-E and the rib 9-R2, and the rib 9-R2can guide the glue to smoothly flow around the curved outer surface9-E1, thereby preventing overflow of the glue and enhancing the adhesionstrength between the holder 9-R and the optical element 9-E.

FIG. 9-9 is an exploded view showing a frame 9-F, two magneticconductive members 9-Q, two magnets 9-M, a holder 9-R, and a coil 9-C inaccordance with another embodiment of the disclosure. FIG. 9-10 is across-sectional view of the frame 9-F, the magnetic conductive members9-Q, the magnets 9-M, the holder 9-R, and the coil 9-C in FIG. 9-9 afterassembly. As shown in FIG. 9-9, another embodiment of the drivingmechanism comprise two magnetic conductive members 9-Q which has metalmaterial and can be integrally formed with the plastic frame 9-F byinsert molding, so as to increase the structural strength of the drivingmechanism. It should be noted that the frame 9-F not only forms thevertical surfaces 9-F31 and the sloping surfaces 9-F32 as described inthe foregoing embodiments, but also forms at least a sloping surface9-F33 at a corner of the frame 9-F. It should be noted that the slopingsurface 9-F33 is connected to the vertical surface 9-F31 and the slopingsurface 9-F32, and is angled with respect to the X, Y, and Z axes (e.g.45 degrees), so that a groove can be formed between the inner surface ofthe housing 9-H and the sloping surface 9-F33 for receiving and guidingthe flue to flow. Thus, overflow of the glue can be efficientlyprevented, and adhesion strength between the housing 9-H and the frame9-F can be also enhanced.

Still referring to FIGS. 9 and 10, the two magnetic conductive members9-Q are disposed on opposite sides of the frame 9-F and respectivelyhave an inverted U-shaped structure. The magnet 9-M can be affixed tothe frame 9-F and received in the inverted U-shaped structure, so thatthe magnetic field distribution of the magnet 9-M can be improved by themagnetic conductive member 9-Q, to enhance the electromagnetic drivingforce generated by the magnet 9-M and the coil 9-C.

FIG. 9-11 is an exploded view showing a frame 9-F and a magneticconductive member 9-Q in accordance with another embodiment of thedisclosure. FIG. 9-12 is an exploded view showing the frame 9-F and themagnetic conductive member 9-Q in FIG. 9-11, two magnets 9-M, a holder9-R, and a coil 9-C disposed on the holder 9-R. FIG. 9-13 is across-sectional view of the frame 9-F, the magnetic conductive member9-Q, the magnets 9-M, the holder 9-R, and the coil 9-C in FIG. 9-12after assembly. As shown in FIG. 9-11, the conductive member 9-Q in thisembodiment can substitute for the two magnetic conductive members 9-Q inFIGS. 9-9 and 9-10. Here, the conductive member 9-Q may comprise metaland have a hollow polygonal structure, and it can be integrally formedwith the plastic frame 9-F by insert molding, so as to increase thestructural strength of the driving mechanism and enhance theelectromagnetic driving force generated by the magnet 9-M and the coil9-C.

As shown in FIGS. 9-11 to 9-13, the conductive member 9-Q has twoinverted U-shaped structures on opposite sides of the frame 9-F andcorresponding to the magnets 9-M. The two magnets 9-M are affixed to theframe 9-F and received in the inverted U-shaped structures,respectively. It should be noted that a protrusion 9-Q1 is formed on thetop of the inverted U-shaped structure and extended upwardly toward alight incident side of the optical axis 9-O (Z axis). The protrusion9-Q1 is located corresponding to the coil 9-C (FIG. 9-13), so that theholder 9-R and the coil 9-C can move with respect to the frame 9-Fwithin a large range along the Z axis to enhance the auto-focus (AF)function.

FIG. 9-14 is a schematic view showing relative position of a frame 9-F,an upper spring 9-S1, and four magnets 9-M after assembly of a drivingmechanism, in accordance with another embodiment of the disclosure.Referring to FIG. 9-14, the frame 9-F in this embodiment forms severalstages 9-F4 protruding from a bottom side thereof. Moreover, at leastone thickened portion 9-F5 is formed on an inner side of the frame 9-F.Since the thickened portion 9-F5 extends toward the center of the frame9-F, the adhesion area between the frame 9-F and the upper spring 9-S1can be increased, and the structural strength of the driving mechanismcan also be enhanced.

It should be noted that at least a gap 9-G is formed between the frame9-F and the upper spring 9-S1 in a vertical direction, and the gap 9-Gis located between two adjacent stages 9-F4 in a horizontal direction.Therefore, the poor positioning accuracy and assembly difficulty owingto excessively large bonding area between the frame 9-F and the upperspring 9-S1 can be circumvented.

FIG. 9-15 is a schematic view showing relative position of a frame 9-F,an upper spring 9-S1, and four magnets 9-M after assembly of a drivingmechanism, in accordance with another embodiment of the disclosure.Referring to FIG. 9-15, the frame 9-F has a polygonal structure andcomprises magnetic conductive material, wherein at least a recess 9-F6is formed close to a corner of the frame 9-F for receiving and guidingthe glue between the housing 9-H and the frame 9-F, so as to efficientlyprevent overflow of the glue and enhance adhesion strength between thehousing 9-H and the frame 9-F. In some embodiments, the frame 9-F mayalso be affixed to the housing 9-H by soldering or welding process tofurther enhance the connection strength thereof.

FIG. 9-16 is a cross-sectional view showing a holder 9-R, at least onelower spring 9-S2, and a base 9-B after assembly of a driving mechanism,in accordance with another embodiment of the disclosure. Referring toFIG. 9-16, the base 9-B in this embodiment is affixed to the housing 9-Hof the driving mechanism, wherein the base 9-B forms a connectionsurface 9-B1, a restricting surface 9-B2, and a recessed portion 9-B3between the connection surface 9-B1 and the restricting surface 9-B2.During assembly of the driving mechanism, the glue is disposed on theconnection surface 9-B1, so that a part of the lower spring 9-S2 can beadhered to the connection surface 9-B1. Moreover, when the holder 9-Rmoves downwardly relative to the base 9-B along the Z axis, a contactportion 9-R4 of the holder 9-R can contact the restricting surface 9-B2,so that the holder 9-R is restricted in a limit position, wherein therestricting surface 9-B2 is lower than the connection surface 9-B1. Itshould be noted that the recessed portion 9-B3 is lower than theconnection surface 9-B1 and the restricting surface 9-B2 in the Zdirection. Thus, the glue can be received and guided by the recessedportion 9-B3, to prevent the glue from flowing to the restrictingsurface 9-B2 and contacting the holder 9-R.

In summary, a driving mechanism having two adjacent sides with unequallengths is provided in this disclosure. The space in the drivingmechanism may be effectively utilized to achieve mechanismminiaturization through this arrangement. Furthermore, the elasticmember in the driving mechanism has strings with different structures,thereby allowing the presence of the driving mechanism having twoasymmetric sides.

In summary, the present disclosure provides a driving mechanism with adamping member, which is disposed between the positioning member and thecarrier, and is in direct contact with the former two. Therefore, thestability of the driving mechanism can be enhanced. In addition, thepresent disclosure provides a driving mechanism including a positioningmember with a trench, and thereby the contact area of the adhesive maybe increased. The bonding strength is enhanced.

In summary, the driving mechanism of the present disclosure utilizes thedesign of the position element to reduce the pollution particles. Thebuffer groove allows the elastic element to prevent deformation portioncolliding with the carrying base in the frame. Moreover, with thedustproof ring design, fewer contaminating particles fall on the opticalelement. Moreover, the design of the carrying base in the presentdisclosure may prevent the deformation portion of the elastic elementfrom colliding with the carrying base.

In summary, the driving mechanism of the present disclosure may set aplurality of stop portions in the carrying base, so as to disperse theimpact force of the carrying base on the frame or the base. Therefore,the driving mechanism can be protected and the strength of the carryingbase can be improved.

In summary, a driving mechanism is provided, including a carrier, anoptical lens, a first electromagnetic driving assembly, a fixed portion,and a first elastic member. The carrier has a side wall, and the opticallens is disposed in the carrier. The first electromagnetic drivingassembly is disposed on the carrier. The side wall is disposed betweenthe optical lens and the first electromagnetic driving assembly, and theoptical lens and the first electromagnetic driving assembly is incontact with the side wall. The first elastic member is connected to thecarrier and the fixed portion. At least a portion of the first elasticmember overlaps the side wall as observed from the optical axis of theoptical lens.

In summary, a driving mechanism for supporting an optical member isprovided, including a base, a frame, a movable portion, a drivingmodule, and an adhesive member. The base includes a plurality of firstsidewalls, and at least one recess is formed on the first sidewalls. Theframe includes a plurality of second sidewalls, and at least one openingis formed on the second sidewalls. The base and the frame can form ahollow box, and the opening corresponds to the recess. The movableportion and the driving module are disposed in the hollow box. Thedriving module can drive the movable portion to move relative to thebase. The adhesive member is accommodated in the opening and the recess,and extended along the first sidewalls. The adhesive member is disposedbetween the first sidewalls and the second sidewalls, and the first andsecond sidewalls are parallel to the optical axis of the optical member.

In summary, the disclosure provides a driving mechanism for moving anoptical element. According to some embodiments, a frame of the drivingmechanism may form a depressed or sloping surface which is angled withrespect to the optical axis of the optical element. According to someembodiments, a frame or a base of the driving mechanism may havespecific structures for receiving or guiding the flue. Thus, overflow ofthe glue during assembly and malfunction of the driving mechanism can beprevented. Additionally, one or several magnetic conductive members mayalso be disposed on the frame, so as to enhance the electromagneticdriving force generated by the magnet and the coil and improve thestructural strength of the driving mechanism.

Although embodiments of the present disclosure and their advantages havebeen described in detail, it should be understood that various changes,substitutions and alterations can be made herein without departing fromthe spirit and scope of the disclosure as defined by the appendedclaims. For example, it will be readily understood by those skilled inthe art that many of the features, functions, processes, and materialsdescribed herein may be varied while remaining within the scope of thepresent disclosure. Moreover, the scope of the present application isnot intended to be limited to the particular embodiments of the process,machine, manufacture, composition of matter, means, methods and stepsdescribed in the specification. As one of ordinary skill in the art willreadily appreciate from the disclosure of the present disclosure,processes, machines, manufacture, compositions of matter, means,methods, or steps, presently existing or later to be developed, thatperform substantially the same function or achieve substantially thesame result as the corresponding embodiments described herein may beutilized according to the present disclosure. Accordingly, the appendedclaims are intended to include within their scope such processes,machines, manufacture, compositions of matter, means, methods, or steps.In addition, each claim constitutes a separate embodiment, and thecombination of various claims and embodiments are within the scope ofthe disclosure.

The disclosed features may be combined, modified, or replaced in anysuitable manner in one or more disclosed embodiments, but are notlimited to any particular embodiments.

What is claimed is:
 1. A driving mechanism, comprising: a frame; acarrying base disposed on the frame, comprising: a carrying bodyconfigured to carry an optical element; a first stop portion disposed onthe carrying body, and configured to limit a range of motion of thecarrying body in a first direction; and a second stop portion disposedon the carrying body, and configured to limit the range of motion of thecarrying body in the first direction; and a drive module disposed in theframe, and configured to drive the carrying base to move relative to theframe, wherein the first direction is parallel to an optical axis thatpasses through the optical element, and the first stop portion is closerto a top portion of the frame than the second stop portion.
 2. Thedriving mechanism as claimed in claim 1, wherein the first stop portionis located between the carrying base and the top portion of the frame.3. The driving mechanism as claimed in claim 2, wherein the second stopportion is formed in the carrying body, and the first stop portion andthe second stop portion extend in the first direction.
 4. The drivingmechanism as claimed in claim 1, further comprising a top elasticelement disposed on the carrying body and adjacent to the top portion,wherein the distance between the top elastic element and the top portionof the frame is greater than the distance between the first stop portionand the top portion of the frame, and the distance between the secondstop portion and the top portion of the frame is greater than thedistance between the top elastic element and the top portion of theframe.
 5. The driving mechanism as claimed in claim 1, wherein thecarrying base further comprises a wire holder disposed on a side surfaceof the carrying body, and the drive module further comprises a drivewire disposed on the wire holder and a magnetic element disposed on aside wall of the frame, wherein the wire holder is closer to themagnetic element than the drive wire.
 6. The driving mechanism asclaimed in claim 5, wherein the wire holder further comprises a gluegroove, and glue is filled into the glue groove, and is in contact withthe drive wire and the wire holder.
 7. The driving mechanism as claimedin claim 6, wherein the wire holder further comprises a reinforcingportion disposed in the glue groove, and the reinforcing portion has anupper surface and an inclined surface inclined relative to the uppersurface.
 8. The driving mechanism as claimed in claim 1, wherein thecarrying base further comprises a side-stop portion disposed on a firstside surface of the carrying body, and configured to limit the range ofmotion of the carrying body in a second direction, wherein at least aportion of the drive module is disposed in a receiving groove of theside-stop portion, and the second direction is perpendicular to thefirst direction.
 9. The driving mechanism as claimed in claim 7, furthercomprising a position sensing module disposed on a second side surfaceof the carrying body, wherein the drive module is disposed on a thirdside surface of the carrying body.
 10. The driving mechanism as claimedin claim 1, wherein the first stop portion is far from a central area ofa side wall of the frame.
 11. The driving mechanism as claimed in claim1, wherein the carrying base further comprises: a third stop portiondisposed on a bottom surface of the carrying body, and configured tolimit the range of motion of the carrying body in the first direction;and a fourth stop portion disposed on the bottom surface of the carryingbody, and configured to limit the range of motion of the carrying bodyin the first direction; wherein the first stop portion and the secondstop portion are disposed on a top surface of the carrying body oppositethe bottom surface, and a width of the third stop portion is less than awidth of the fourth stop portion.
 12. The driving mechanism as claimedin claim 11, further comprising a bottom elastic element disposed on thebottom surface of the carrying body, wherein the bottom elastic elementcomprises: a first fixed portion affixed to the frame; a deformationportion connected to the first fixed portion, and separated from thecarrying body; a second fixed portion affixed to the carrying body; aconnection portion connected to the second fixed portion, and in contactwith the carrying body; wherein the third stop portion is adjacent tothe connection portion, and the fourth stop portion is adjacent to thedeformation portion.
 13. The driving mechanism as claimed in claim 12,wherein the carrying body further comprises a restriction portion and anoverflow groove, and the overflow groove is closer to the optical axisthan the restriction portion, wherein the second fixed portion isaffixed to the restriction portion.
 14. The driving mechanism as claimedin claim 1, wherein the carrying body further comprises a plurality ofbottom stop portions disposed on a side surface and a bottom surface ofthe carrying body, and configured to limit the range of motion of thecarrying body in a first direction and a lateral direction, wherein thelateral direction is perpendicular to the first direction.
 15. Thedriving mechanism as claimed in claim 14, further comprising a bottomelastic element located between the bottom stop portions.
 16. Thedriving mechanism as claimed in claim 1, further comprising a basedisposed on the frame, wherein the base comprises: a base body; and ablocking wall disposed on the base body, and located between the frameand the carrying body, wherein the blocking wall has a groove adjacentto the frame.